Why package lithography matters in heterogeneous chiplet integration
By Majeed Ahmad, EDN (December 13, 2023)
Digital lithography technology (DLT) is promising chipmakers to combine chips with submicron wiring on glass and other large substrates. And this maskless technology is at the center of a strategic partnership between Applied Materials and Ushio, aiming to accelerate the semiconductor industry’s transition to heterogeneous chiplet integration.
Applied Materials has been introducing materials, technologies, and systems that help chipmakers integrate chiplets into advanced 2.5D and 3D packages using hybrid bonding and through-silicon via (TSV) technologies. These initiatives complement heterogeneous integration (HI), which combines multiple chiplets in an advanced package with higher performance and bandwidth than a monolithic chip.
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