PPAC Driven Multi-die and Multi-technology Floorplanning
April 8, 2025
Chiplet Technical Papers
Taking 3D IC Heterogeneous Integration Mainstream
March 27, 2025
CATCH: a Cost Analysis Tool for Co-optimization of chiplet-based Heterogeneous systems
March 25, 2025
Three-dimensional photonic integration for ultra-low-energy, high-bandwidth interchip data links
March 24, 2025
Defect Analysis and Built-In-Self-Test for Chiplet Interconnects in Fan-out Wafer-Level Packaging
March 21, 2025
ARCAS: Adaptive Runtime System for Chiplet-Aware Scheduling
March 18, 2025
Fulfilling 3D-IC Trade-Off Analyses (And Benefits) With An AI Assist
March 13, 2025
Garblet: Multi-party Computation for Protecting Chiplet-based Systems
March 12, 2025
Speeding Down Memory Lane With Custom HBM
March 11, 2025
Multi-Die Health and Reliability: Synopsys and TSMC Showcase UCIe Advances
March 7, 2025
REED: Chiplet-based Accelerator for Fully Homomorphic Encryption
March 5, 2025
Signal Integrity Challenges in Chiplet-Based Designs: Addressing Performance and Security
March 4, 2025
DiffChip: Thermally Aware Chip Placement with Automatic Differentiation
February 26, 2025
IP for 3D Multi-Die Designs
February 26, 2025
Chiplet-Based Techniques for Scalable and Memory-Aware Multi-Scalar Multiplication
February 21, 2025
Co-Optimization of Power Delivery Network Design for 3-D Heterogeneous Integration of RRAM-Based Compute In-Memory Accelerators
February 17, 2025
Exploring the Potential of Wireless-enabled Multi-Chip AI Accelerators
February 8, 2025
PlaceIT: Placement-based Inter-Chiplet Interconnect Topologies
February 5, 2025
3D integration of pixel readout chips using Through-Silicon-Vias
January 22, 2025
Introducing 2D-material based devices in the logic scaling roadmap
January 19, 2025
