Automakers And Industry Need Specific, Extremely Robust, Heterogeneously Integrated Chiplet Solutions
December 12, 2024
Chiplet Technical Papers
Efficient ESD Verification For 2.5/3D Automotive ICs
December 9, 2024
Heterogeneous Integration Technologies for Artificial Intelligence Applications
December 4, 2024
Performance Implications of Multi-Chiplet Neural Processing Units on Autonomous Driving Perception
December 3, 2024
ChipAI: A scalable chiplet-based accelerator for efficient DNN inference using silicon photonics
December 2, 2024
Advanced Packaging and Chiplets Can Be for Everyone
December 2, 2024
Interfacing silicon photonics for high-density co-packaged optics
November 29, 2024
System-Technology Co-Optimization for Dense Edge Architectures using 3D Integration and Non-Volatile Memory
November 28, 2024
High-Bandwidth Chiplet Interconnects for Advanced Packaging Technologies in AI/ML Applications: Challenges and Solutions
November 27, 2024
Analysis Of Multi-Chiplet Package Designs And Requirements For Production Test Simplification
November 21, 2024
Spiking Transformer Hardware Accelerators in 3D Integration
November 14, 2024
GATE-SiP: Enabling Authenticated Encryption Testing in Systems-in-Package
November 13, 2024
AIG-CIM: A Scalable Chiplet Module with Tri-Gear Heterogeneous Compute-in-Memory for Diffusion Acceleration
November 13, 2024
Chiplever: Towards Effortless Extension of Chiplet-based System for FHE
November 11, 2024
The Survey of Chiplet-based Integrated Architecture: An EDA perspective
November 8, 2024
2D materials-based 3D integration for neuromorphic hardware
November 5, 2024
3D Integration, Advanced Metrology Shape the Semiconductor Landscape
November 4, 2024
Synopsys 3DIO Solution for Multi-Die Integration (2.5D/3D)
November 4, 2024
Communication Characterization of AI Workloads for Large-scale Multi-chiplet Accelerators
October 31, 2024
ControlPULPlet: A Flexible Real-time Multi-core RISC-V Controller for 2.5D Systems-in-package
October 23, 2024
