Chiplet-Based Techniques for Scalable and Memory-Aware Multi-Scalar Multiplication
February 21, 2025
Chiplet Technical Papers
Co-Optimization of Power Delivery Network Design for 3-D Heterogeneous Integration of RRAM-Based Compute In-Memory Accelerators
February 17, 2025
Exploring the Potential of Wireless-enabled Multi-Chip AI Accelerators
February 8, 2025
PlaceIT: Placement-based Inter-Chiplet Interconnect Topologies
February 5, 2025
3D integration of pixel readout chips using Through-Silicon-Vias
January 22, 2025
Introducing 2D-material based devices in the logic scaling roadmap
January 19, 2025
Modular Compilation for Quantum Chiplet Architectures
January 16, 2025
Ammonia Plasma Surface Treatment for Enhanced Cu–Cu Bonding Reliability for Advanced Packaging Interconnection
January 13, 2025
Energy-/Carbon-Aware Evaluation and Optimization of 3-D IC Architecture With Digital Compute-in-Memory Designs
January 8, 2025
Optimized Low Parasitic Capacitance ESD Clamps for High-Bandwidth 2.5D/3D Chiplet Interfaces in Advanced FinFET Technology
January 2, 2025
Why Chiplet-Based Architecture Is the Next Frontier in Semiconductors
December 24, 2024
Automakers And Industry Need Specific, Extremely Robust, Heterogeneously Integrated Chiplet Solutions
December 12, 2024
Efficient ESD Verification For 2.5/3D Automotive ICs
December 9, 2024
Heterogeneous Integration Technologies for Artificial Intelligence Applications
December 4, 2024
Performance Implications of Multi-Chiplet Neural Processing Units on Autonomous Driving Perception
December 3, 2024
ChipAI: A scalable chiplet-based accelerator for efficient DNN inference using silicon photonics
December 2, 2024
Advanced Packaging and Chiplets Can Be for Everyone
December 2, 2024
Interfacing silicon photonics for high-density co-packaged optics
November 29, 2024
System-Technology Co-Optimization for Dense Edge Architectures using 3D Integration and Non-Volatile Memory
November 28, 2024
High-Bandwidth Chiplet Interconnects for Advanced Packaging Technologies in AI/ML Applications: Challenges and Solutions
November 27, 2024
