Mark Wade of Ayar Labs: We Solve AI data Movement Challenges with Optical Chiplets
EE Times spoke to Mark Wade, CEO of Ayar Labs, at the OFC 2024 conference in San Diego, to talk about how optical chiplets solve the data movement challenges for AI applications, enabling both efficiency and "economic productivity." We talk about Ayar Labs and how the company's connectivity solution addresses both AI and telecoms markets.
Related Chiplet
Related Videos
- The future of AI: Chiplets & Lasers
- All About Optical Interconnects
- Moving Data at the Speed of AI
- Photonic Fabric Interface Chiplets for AI XPU Optical Connectivity
Latest Videos
- 3D IC Podcast | The future of 3D ICs: How advanced packaging is changing the industry
- Mick Posner talks about the importance of UCIe
- Optimizing Chiplet architectures of RISC-V clusters, GPU and DNN using System-Level IP
- Speeding Up Die-To-Die Interconnectivity
- GENIOEVO™ – Architectural Exploration and Connectivity Management in Advanced Packaging