Intel Demonstrates First Fully Integrated Optical I/O Chiplet for More Scalable AI
Intel‘s leading optical compute interconnect (OCI) chiplet addresses the emerging need for higher bandwidth, lower power and longer reach, enabling future AI scalability and novel compute architectures. The first 4 Tbps bidirectional OCI chiplet co-packaged with a concept CPU was showcased at OFC2024, demonstrating the maturity of Intel’s in-house, proven Silicon Photonics technology and platform.
Related Chiplet
- Interconnect Chiplet
- 12nm EURYTION RFK1 - UCIe SP based Ka-Ku Band Chiplet Transceiver
- Bridglets
- Automotive AI Accelerator
- Direct Chiplet Interface
Related Videos
- Intel's Optical I/O Chiplet Co-Packaged with Server CPU
- Pat Gelsinger on the Universal Chiplet Interconnect Express (UCIe)
- Chiplet Architecture Accelerates Delivery of Industry-Leading Intel® FPGA Features and Capabilities
- Architecting Next Generation Compute and I/O Chiplet for AI/ML, Cloud and Edge Platforms
Latest Videos
- Accelerate 3D IC designs with Innovator3D IC
- On Package Memory with Universal Chiplet Interconnect Express (UCIe): A Low-Power, High-Bandwith, Low-Latency and Low-Cost Approach
- Breaking down 50 million pins: A smarter way to design 3D IC packages
- Optimizing Data Movement in SoCs and Advanced Packages
- Cache Coherency in Heterogeneous Systems