Intel Demonstrates First Fully Integrated Optical I/O Chiplet for More Scalable AI
Intel‘s leading optical compute interconnect (OCI) chiplet addresses the emerging need for higher bandwidth, lower power and longer reach, enabling future AI scalability and novel compute architectures. The first 4 Tbps bidirectional OCI chiplet co-packaged with a concept CPU was showcased at OFC2024, demonstrating the maturity of Intel’s in-house, proven Silicon Photonics technology and platform.
Related Videos
- Intel's Optical I/O Chiplet Co-Packaged with Server CPU
- Pat Gelsinger on the Universal Chiplet Interconnect Express (UCIe)
- Chiplet Architecture Accelerates Delivery of Industry-Leading Intel® FPGA Features and Capabilities
- Architecting Next Generation Compute and I/O Chiplet for AI/ML, Cloud and Edge Platforms
Latest Videos
- GSCM 2024: Interview with A.M. Fitzgerald and Associates' Alissa Fitzgerald
- Electronica 2024 - Shaping the Future of Automotive Electronics with Chiplets and Sustainability
- UCIe 2.0 Specification: Advancing an open ecosystem for on-package chiplet innovation
- Accelerating AI Innovation with Arm Total Design: A Case Study
- The Rise of The Hublet™ & FPGA Chiplets