Custom Tool Development Strategies for Chiplet Reliability
Watch the COIN-3D Webinar #2 – Custom Tool Development Strategies for Chiplet Reliability
In this session, we explored custom tool development strategies for enhancing the reliability of 2.5D and 3D chiplet-based architectures. Our expert speakers shared research insights, methodologies, and tool development experiences targeting critical challenges in semiconductor reliability.
📌 Contents of this video 📌
00:00 - Introduction
01:51 - CoMeT: Interval Thermal Simulator for 3D ICs
14:14 - Physical Hierarchy Exploration of 3-D ICs
42:25 - PROTON: Physics-Based Electromigration Assessment on Modern VLSI Power Grids
58:44 - Q&A Session
🎙️ Speakers:
- Dr. George Floros – University of Thessaly
- Dr. Anuj Pathania – University of Amsterdam
- Dr. Olympia Axelou – University of Thessaly
- Dr. Alberto Garcia-Ortiz – University of Bremen
🌐 COIN3D is a collaboration between:
- University of Thessaly
- University of Amsterdam
- University of Bremen
- University of Glasgow
💡 The project is co-funded by the European Union under the Horizon Europe programme.
🔗 Learn more: https://coin3d-project.eu
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