Three-Way Race To 3D-ICs

Intel, TSMC, and Samsung are developing a broad set of technologies and relationships that will be required for the next generation of AI chips.

By Ed Sperling, Semi Engineering | May 5th, 2025

Intel Foundry, TSMC, and Samsung Foundry are scrambling to deliver all the foundational components of full 3D-ICs, which collectively will deliver orders of magnitude improvements in performance with minimal power sometime within the next few years.

Much attention has been focused on process node advances, but a successful 3D-IC implementation is much more complex and comprehensive than just scaling digital logic. It requires new materials, and different ways of handling thinner substrates and putting them together.

To read the full article, click here