Chiplets Make Case for More Apps
By Spencer Chin, Design News (February 21, 2024)
AI, high-end computing, and even consumer applications will require the scalability and flexibility of chiplets to meet future packaging needs.
Many chiplet packaging discussions have focused on applications in high-end computing where high density and low latency are needed. But the flexibility and other advantages chiplets offer are also of appeal to makers of complex consumer products, such as AR/VR headsets.
At the recent DesignCon show in Santa Clara, these issues came front and center during a panel session titled, “Chiplets in consumer electronics and infrastructure.” What immediately became obvious was that existing silicon-on-chip technology could no longer scale in a cost-efficient manner for consumer electronics.
To read the full article, click here
Related Chiplet
- 12nm EURYTION RFK1 - UCIe SP based Ka-Ku Band Chiplet Transceiver
- Interconnect Chiplet
- Bridglets
- Automotive AI Accelerator
- Direct Chiplet Interface
Related News
- Chiplets Make Progress Using Interconnects As Glue
- EdgeCortix Receives 4 Billion Yen Subsidy from Japan’s NEDO to Advance Energy-Efficient AI Chiplets for Post-5G Communication Systems
- Testing For Thermal Issues Becomes More Difficult
- DreamBig Semiconductor Announces Partnership with Samsung Foundry to Launch Chiplets for World Leading MARS Chiplet Platform on 4nm FinFET Process Technology Featuring 3D HBM Integration to Solve Scale-up and Scale-out Limitations of AI for the Masses
Latest News
- SiMa.ai Expands Strategic Collaboration with Synopsys to Accelerate Automotive AI Innovation
- When Standards Enable Chiplets
- Multibeam Secures $31 Million in Series B Financing to Accelerate Global Deployment of E-Beam Lithography Production Solutions
- Alphawave Semi Highlights Why the Next Generation of AI Advances Demand Chiplet Architectures at EE Times: The Future of Chiplets
- CoAsia SEMI and Rebellions Join Forces to Jointly Develop Next-Generation AI Chiplet Based on REBEL