Security Is Critical For Commercial Chiplets
By Ann Mutschler, SemiEngineering (March 13th, 2024)
Data management, trust, traceability, and provenance tracking are essential to making a chiplet marketplace work.
Semiconductor Engineering sat down to talk about the security issues and requirements in commercial chiplet ecosystem, with Frank Schirrmeister, vice president solutions and business development at Arteris; Mayank Bhatnagar, product marketing director in the Silicon Solutions Group at Cadence; Paul Karazuba, vice president of marketing at Expedera; Stephen Slater, EDA product management/integrating manager at Keysight; Kevin Rinebold, account technology manager for advanced packaging solutions at Siemens EDA; and Mick Posner, vice president of product management for high-performance computing IP solutions at Synopsys. What follows are excerpts of that discussion.
To read the full article, click here
Related Chiplet
- 12nm EURYTION RFK1 - UCIe SP based Ka-Ku Band Chiplet Transceiver
- Interconnect Chiplet
- Bridglets
- Automotive AI Accelerator
- Direct Chiplet Interface
Related News
- Proprietary Vs. Commercial Chiplets
- Cyber Threats Multiply With Commercial Chiplets
- Faraday Unveils 2.5D/3D Advanced Package Service for Chiplets
- A methodology for turning an SoC into chiplets
Latest News
- Siemens expands OSAT Alliance membership to build domestic semiconductor supply chains
- Marvell Delivers Advanced Packaging Platform for Custom AI Accelerators
- Executive Outlook: Chiplets, 3D-ICs, and AI
- AMD Acquires Enosemi to Accelerate Co-Packaged Optics Innovation for AI Systems
- ASE Announces FOCoS-Bridge With TSV; Latest Package Technology Reduces Power Loss by 3x for Next-Generation AI and HPC Applications