Proprietary Vs. Commercial Chiplets
Who wins, who loses, and where are the big challenges for multi-vendor heterogeneous integration.
Ed Sperling, SemiEngineering (December 19, 2023)
Large chipmakers are focusing on chiplets as the best path forward for integrating more functions into electronic devices. The challenge now is how to pull the rest of the chip industry along, creating a marketplace for third-party chiplets that can be chosen from a menu using specific criteria that can speed time to market, help to control costs, and behave as reliably as chiplets developed in-house.
To read the full article, click here
Related Chiplet
- Direct Chiplet Interface
- HBM3e Advanced-packaging chiplet for all workloads
- UCIe AP based 8-bit 170-Gsps Chiplet Transceiver
- UCIe based 8-bit 48-Gsps Transceiver
- UCIe based 12-bit 12-Gsps Transceiver
Related News
- Security Is Critical For Commercial Chiplets
- One Chip Vs. Many Chiplets
- Faraday Unveils 2.5D/3D Advanced Package Service for Chiplets
- A methodology for turning an SoC into chiplets
Latest News
- Test & Yield Challenges of Chiplet-Based Semiconductor Products
- Alphawave Semi Scales UCIe™ to 64 Gbps Enabling >20 Tbps/mm Bandwidth Density for Die-to-Die Chiplet Connectivity
- Silicon Box welcomes European Commission approval of €1.3 billion Italian State aid measure to support new advanced packaging facility in Novara
- Fraunhofer IMS Takes a Key Role in Establishing the APECS Pilot Line
- EdgeCortix Joins AI-RAN Alliance to Accelerate the Integration of AI and Next-gen RAN Infrastructure