Proprietary Vs. Commercial Chiplets
Who wins, who loses, and where are the big challenges for multi-vendor heterogeneous integration.
Ed Sperling, SemiEngineering (December 19, 2023)
Large chipmakers are focusing on chiplets as the best path forward for integrating more functions into electronic devices. The challenge now is how to pull the rest of the chip industry along, creating a marketplace for third-party chiplets that can be chosen from a menu using specific criteria that can speed time to market, help to control costs, and behave as reliably as chiplets developed in-house.
To read the full article, click here
Related Chiplet
- Interconnect Chiplet
- 12nm EURYTION RFK1 - UCIe SP based Ka-Ku Band Chiplet Transceiver
- Bridglets
- Automotive AI Accelerator
- Direct Chiplet Interface
Related News
- Security Is Critical For Commercial Chiplets
- One Chip Vs. Many Chiplets
- Cyber Threats Multiply With Commercial Chiplets
- Faraday Unveils 2.5D/3D Advanced Package Service for Chiplets
Latest News
- Silicon 100: Chiplet work spanning interconnect PHYs to smart substrates
- Syenta Raises A$8.8M to Break AI’s Memory Wall with Next-Gen Chip Packaging Technology
- ASICLAND Initiates Two Chiplet SoC Development Contracts with Primemas Worth a Total of KRW 16 Billion
- OKI Develops Tiling crystal film bonding (CFB) Technology for Heterogeneous Integration of Optical Semiconductors onto 300 mm Silicon Wafers
- Cadence Accelerates Development of Billion-Gate AI Designs with Innovative Power Analysis Technology Built on NVIDIA