More Data, More Redundant Interconnects

Circuits are being pushed harder and longer, particularly with AI, speeding up the aging of data paths. Photonics adds its own complications.

By Ed Sperling, Semi Engineering | May 19th, 2025 

In the past, nearly all redundant data paths were contained within a planar chip using a relatively thick silicon substrate. But as chipmakers migrate from planar SoCs to multi-die assemblies, many of the data paths in a package are external. Chiplets need to communicate with other chiplets and various memories scattered throughout a package, and they need to move more data back and forth, which generates heat due to the resistance of the wires. Compounding that, the substrates need to be thinned out because that speeds up the signals, which reduces thermal conductivity.

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