KDPOF, Hinge Technology team on chiplets for optical links
By Nick Flaherty, eeNews Europe ( April 25, 2024)
KDPOF in Spain has signed a strategic partnership with Hinge Technology in China to solve key technical issues in the industrial application of chiplets for optical communications in vehicles.
Hinge Technology uses transceivers from KDPOF to design integrated optical modules combined with automotive-grade connectors and optical fibre harnesses to design the electrical electronic architecture (EEA).
The two are jointly researching and developing advanced chip-on-panel (COP) packaging technology using chiplets for low-cost, high-reliability optical processors, optical modules, and complementary optical components tailored for automotive optical communications. This initiative aims to ensure production capacity for various automotive optical communications products.
To read the full article, click here
Related Chiplet
- Interconnect Chiplet
- 12nm EURYTION RFK1 - UCIe SP based Ka-Ku Band Chiplet Transceiver
- Bridglets
- Automotive AI Accelerator
- Direct Chiplet Interface
Related News
- Alphawave Semi at the Forefront of PCIe® 7.0 Specification: Showcasing Next-Gen Chiplet Interoperability and Optical PCIe Technology at PCI-SIG® Developers Conference 2025
- Avicena Demonstrates 30m Reach of microLED-based LightBundle Technology at European Conference on Optical Communications
- Renesas Unveils Industry’s First Automotive Multi-Domain SoC Built with 3-nm Process Technology with Chiplet Extensions
- Eliyan Ports Industry’s Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
Latest News
- Geometry Challenges in Multidie Thermal Management
- SCHMID Announces Successful Delivery and Installation of its InfinityLine C+ System to a Leading Japanese Advanced Packaging Customer
- Marvell to Acquire Celestial AI, Accelerating Scale-up Connectivity for Next-Generation Data Centers
- NGK to Triple Production Capacity for HICERAM Carrier Strengthening Response to the Next-Generation Semiconductor Market
- Neuromorphic Photonic Computing: Lights On