SK hynix Reportedly Plans to Implement Chiplet Technology in Memory Controllers within Three Years
As designing and manufacturing large monolithic ICs became more complex, related challenges regarding yield and cost have emerged for semiconductor companies, which boosts the popularity of chiplets. Now the wave has been spreading to the memory sector. According to a report by TheElec, SK hynix intends to integrate the chiplet technology into its memory controllers over the next three years to improve cost management.
In January, the company applied for a brand name called MOSAIC, which represents its chiplet technology, the report notes.
Citing SK hynix Executive Vice President Moon Ki-ill, the report notes that the company currently collaborates with TSMC as the foundry for manufacturing its controllers.
To read the full article, click here
Related Chiplet
- Interconnect Chiplet
- 12nm EURYTION RFK1 - UCIe SP based Ka-Ku Band Chiplet Transceiver
- Bridglets
- Automotive AI Accelerator
- Direct Chiplet Interface
Related News
- SK hynix Ramps up CXL Push with First In-House Controller, Reportedly to be Built by TSMC
- SK hynix Signs Investment Agreement of Advanced Chip Packaging with Indiana
- SK hynix Partners with TSMC to Strengthen HBM Technological Leadership
- SK hynix Signs Preliminary Memorandum of Terms with U.S. Department of Commerce for Advanced Packaging Facility in Indiana
Latest News
- HyperLight Introduces 110 GHz Reference IQ Modulators covering optical O, C and L wavelength bands for 240 GBaud Class Applications
- YES Receives Multiple VeroTherm™ and VeroFlex™ System Orders from Leading Memory Supplier
- Rebellions Raises $250 Million to Advance the Next Generation AI Infrastructure, Backed by Arm and Samsung
- Credo to Acquire Hyperlume, Inc.
- GlobalFoundries and Corning Collaborate To Deliver Detachable Fiber Connector Solutions to Scale Next-Generation Optical Connectivity