Jumpstarting The Automotive Chiplet Ecosystem
By Steve Brown, Cadence
SemiEngineering (March 28, 2024)
A chiplet reference design built specifically for ADAS.
The automotive industry stands on the cusp of a technological renaissance, ushering in an era where vehicles aren’t just tools of transportation, but interconnected nodes within a vast network of software-defined mobility. Central to this transformation is the concept of chiplets—miniaturized, modular components that can be mixed, matched, and scaled to create powerful, application-specific integrated circuits (ASICs).
In a major push to advance the automotive chiplet ecosystem, Cadence Design Systems and Arm have teamed up to slash development time, accelerate product innovation, and foster a new era of collaboration. Here’s a detailed look at how the resulting chiplet reference design and software development platform are paving the way for the next phase of automotive innovation.
To read the full article, click here
Related Chiplet
- Direct Chiplet Interface
- HBM3e Advanced-packaging chiplet for all workloads
- UCIe AP based 8-bit 170-Gsps Chiplet Transceiver
- UCIe based 8-bit 48-Gsps Transceiver
- UCIe based 12-bit 12-Gsps Transceiver
Related News
- Cadence Collaborates with Arm to Jumpstart the Automotive Chiplet Ecosystem
- Automotive Chiplet Ecosystem Heralds Agility and Flexibility
- 4 takeaways from the 2nd automotive chiplet conference
- Kalray and Arm to collaborate to bring data intensive processing and AI acceleration DPU solutions to the global Arm ecosystem
Latest News
- Back-End Packaging And Test: From Lessons Learned To Future Innovations
- Developing the Framework of Chiplet Economy with Nandan, Baya Systems
- Lam Research Ushers in New Era of Semiconductor Metallization with ALTUS® Halo for Molybdenum Atomic Layer Deposition
- EV Group Highlights Revolutionary Temporary Wafer Bonding and Debonding Solution for HBM and 3D DRAM at SEMICON Korea
- What’s Next In Advanced Packaging?