Inside The World Of Advanced Packaging
By Mark LaPedus, Semiecosystem (January 2, 2025)
Bob Patti, president and chief executive of NHanced Semiconductors, sat down with Semiecosystem to discuss the future of Moore’s Law, advanced packaging, chiplets and Foundry 2.0. Patti also outlined the expansion plans at U.S.-based NHanced, a pure-play advanced packaging foundry. The company’s manufacturing capabilities include 3DICs, chiplets, interposers and other technologies.
To read the full article, click here
Related Chiplet
- DPIQ Tx PICs
- IMDD Tx PICs
- Near-Packaged Optics (NPO) Chiplet Solution
- High Performance Droplet
- Interconnect Chiplet
Related News
- ISE Labs Investment Secures the Establishment of New Site for Semiconductor Packaging and Test in Mexico
- Advanced Packaging Drives New Memory Solutions for the AI Era
- KLA Unveils Comprehensive IC Substrate Portfolio for a New Era of Advanced Semiconductor Packaging
- The Evolution of Interconnects in Microelectronics Packaging
Latest News
- GlobalFoundries qualifies SLATE™ advanced packaging technology on 9SW platform for next-generation radio frequency applications
- Qnity Powers the Transition from Shrink to Stack with Advanced Packaging Solutions
- NHanced Semiconductors President Robert Patti to Deliver Plenary Presentation on the Critical Role of Advanced Packaging at the 2026 Lithography Workshop
- Intel Announces Leadership Appointment at Intel Foundry to Accelerate Development and Manufacturing
- HyperLight Announces $80 Million Series C to Accelerate TFLN Deployment for AI Infrastructure