Inside The World Of Advanced Packaging
By Mark LaPedus, Semiecosystem (January 2, 2025)
Bob Patti, president and chief executive of NHanced Semiconductors, sat down with Semiecosystem to discuss the future of Moore’s Law, advanced packaging, chiplets and Foundry 2.0. Patti also outlined the expansion plans at U.S.-based NHanced, a pure-play advanced packaging foundry. The company’s manufacturing capabilities include 3DICs, chiplets, interposers and other technologies.
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