Inside The World Of Advanced Packaging
By Mark LaPedus, Semiecosystem (January 2, 2025)
Bob Patti, president and chief executive of NHanced Semiconductors, sat down with Semiecosystem to discuss the future of Moore’s Law, advanced packaging, chiplets and Foundry 2.0. Patti also outlined the expansion plans at U.S.-based NHanced, a pure-play advanced packaging foundry. The company’s manufacturing capabilities include 3DICs, chiplets, interposers and other technologies.
To read the full article, click here
Related Chiplet
- Interconnect Chiplet
- 12nm EURYTION RFK1 - UCIe SP based Ka-Ku Band Chiplet Transceiver
- Bridglets
- Automotive AI Accelerator
- Direct Chiplet Interface
Related News
- The Era of Heterogeneous Integration Approaches: Who Shall Dominate the Advanced Packaging Field?
- ISE Labs Investment Secures the Establishment of New Site for Semiconductor Packaging and Test in Mexico
- Silicon Box Accelerates Industry Leadership With Production Commencement at its World Leading Advanced Packaging Facility and Series B Fundraising
- nepes corporation expands IC packaging capabilities for the 3DIC era with advanced design flows from Siemens
Latest News
- Celestial AI Introduces Photonic Fabric™ Module - World’s First SoC with In-Die Optical Interconnect, Ushering in a New Era of Interconnects
- Amkor Announces New Site for U.S. Semiconductor Advanced Packaging and Test Facility
- Arteris Joins UALink Consortium to Accelerate High-Performance AI Networks Scale Up
- Athos Silicon Chief mSoC™ Architect Francois Piednoel to Present the IEEE World Technology Summit 2025 in Berlin
- Marvell Unveils Industry’s First 64 Gbps/wire Bi-Directional Die-to-Die Interface IP in 2nm to Power Next Generation XPUs