The Era of Heterogeneous Integration Approaches: Who Shall Dominate the Advanced Packaging Field?
“It is not the shortage of AI chips, it is the shortage of our CoWoS capacity,” replied TSMC Chairman Mark Liu during an interview in September last year, propelling this technology that TSMC had quietly cultivated for over a decade into a global spotlight.
As per a report from TechNews, the hardware demand sparked by generative AI has also led to “advanced packaging” becoming not only a hot keyword pursued by global investors but also a prominent feature of the semiconductor industry. From foundries and memory manufacturers to OASTs, all are actively involved in the research and capacity expansion of advanced packaging technologies.
TSMC, the leading force in the advanced packaging market, has repeatedly emphasized its efforts to expand capacity during its earnings call, including capacity expansions in Zhunan and Hsinchu, and even the possibility of constructing advanced packaging facilities in Chiayi.
To read the full article, click here
Related Chiplet
- 12nm EURYTION RFK1 - UCIe SP based Ka-Ku Band Chiplet Transceiver
- Interconnect Chiplet
- Bridglets
- Automotive AI Accelerator
- Direct Chiplet Interface
Related News
- 2024 IEEE Electronic Components and Technology Conference to Spotlight Cutting-Edge Microelectronics Packaging Technologies; Photonic Devices, Heterogeneous Integration are Among Key Topics
- Advanced packaging blurs line between monolithic chip and packaged assembly of heterogeneous chips: NAPMP NoI
- CHIPS for America Releases Vision for Approximately $3 Billion National Advanced Packaging Manufacturing Program
- Silicon Box Accelerates Industry Leadership With Production Commencement at its World Leading Advanced Packaging Facility and Series B Fundraising
Latest News
- SiMa.ai Expands Strategic Collaboration with Synopsys to Accelerate Automotive AI Innovation
- When Standards Enable Chiplets
- Multibeam Secures $31 Million in Series B Financing to Accelerate Global Deployment of E-Beam Lithography Production Solutions
- Alphawave Semi Highlights Why the Next Generation of AI Advances Demand Chiplet Architectures at EE Times: The Future of Chiplets
- CoAsia SEMI and Rebellions Join Forces to Jointly Develop Next-Generation AI Chiplet Based on REBEL