SEMI and UCLA Offer Guide to Facilitate Onshoring Advanced Packaging Facilities in the United States
MILPITAS, Calif. — February 5, 2024 — SEMI today announced the availability of a free quick start guide to facilitate the onshoring of advanced packaging facilities in the United States and support the region’s buildout of a semiconductor manufacturing supply chain. Offered by SEMI and the UCLA Center for Heterogeneous Integration and Performance Scaling (CHIPS) and funded by the National Institute of Standards and Technology (NIST), the Manufacturing Roadmap for Heterogeneous Integration and Electronics Packaging (MRHIEP) highlights critical areas of development needed to establish advanced packaging facilities on U.S. soil.
Based on the Heterogeneous Integration Roadmap (HIR), the guide incorporates a manufacturing approach to implement the HIR. Some 100 chip industry veterans from more than 40 companies collaborated with representatives from academic institutions, industrial consortia, and government agencies to develop the guide.
Addressing hardware and software tools, manufacturing processes, and supplier infrastructure, the guide covers tools, processes, standards, and interdependencies that enable advanced packaging for high-performance computing (HPC), medical, health and wearables applications.
“The MRHIEP drills down into operational objectives by examining current capabilities and highlighting critical areas of development needed for onshored manufacturing to be successful in the U.S.,” said Melissa Grupen-Shemansky, SEMI CTO. “The guide provides vital support for implementation of the HIR, a comprehensive document addressing the global supply chain for heterogenous integration.”
Download the guide.
About SEMI
SEMI® is the global industry association connecting over 3,000 member companies and 1.5 million professionals worldwide across the semiconductor and electronics design and manufacturing supply chain. We accelerate member collaboration on solutions to top industry challenges through Advocacy, Workforce Development, Sustainability, Supply Chain Management and other programs. Our SEMICON® expositions and events, technology communities, standards and market intelligence help advance our members’ business growth and innovations in design, devices, equipment, materials, services and software, enabling smarter, faster, more secure electronics. Visit www.semi.org.
Related Chiplet
- Automotive AI Accelerator
- Direct Chiplet Interface
- HBM3e Advanced-packaging chiplet for all workloads
- UCIe AP based 8-bit 170-Gsps Chiplet Transceiver
- UCIe based 8-bit 48-Gsps Transceiver
Related News
- Amkor and TSMC to Expand Partnership and Collaborate on Advanced Packaging in Arizona
- ISE Labs Investment Secures the Establishment of New Site for Semiconductor Packaging and Test in Mexico
- ASE Expands its Chip Packaging and Testing Facility to Enable Next-Gen Applications
- Biden-Harris Administration to Invest Up to $1.6 Billion to Establish and Accelerate Domestic Capacity Advanced Packaging
Latest News
- NHIZ promotes chiplet industry's development and cooperation
- Cadence and TSMC Advance AI and 3D-IC Chip Design with Certified Design Solutions for TSMC’s A16 and N2P Process Technologies
- Breaking the Memory Wall: How d-Matrix Is Redefining AI Inference with Chiplets
- Alphawave Semi Delivers Foundational AI Platform IP for Scale-Up and Scale-Out Networks
- Intel moves to chiplets for automotive AI