Advanced packaging blurs line between monolithic chip and packaged assembly of heterogeneous chips: NAPMP NoI
By Pradeep Chakraborty, Pradeep’s TechPoints (July 17, 2024)
Dr. Subramanian S. Iyer, Senior Technical Advisor, CHIPS NAPMP, recently provided the notice of intent (NoI).
National Advanced Packaging Manufacturing Program (NAPMP) will drive US leadership in advanced packaging and provide the technology needed for packaging manufacturing in the United States. NAPMP will develop critical and relevant innovations for advanced packaging technologies and accelerate their scaled transition to US manufacturing entities.
Within a decade, NAPMP-funded activities, coupled with CHIPS manufacturing incentives, will establish a vibrant, self-sustaining, profitable, high-volume, domestic, advanced packaging industry where advanced-node chips manufactured in the U.S. are packaged in the U.S. We expect the technology developed to be leveraged in new applications and market sectors and at scale.
Packaging roadmaps include NIST-sponsored roadmaps such as MRHIEP, MAESTRO, and MAPT. Other roadmaps include HIR and IRDS. All aspects of technologies are required to develop leading-edge onshore advanced packaging manufacturing capability.
Related Chiplet
- UCIe AP based 8-bit 170-Gsps Chiplet Transceiver
- UCIe based 8-bit 48-Gsps Transceiver
- UCIe based 12-bit 12-Gsps Transceiver
- 400G Transmitter Chiplet for 400G, 800G and 1.6T Pluggable Transceivers
- FPGA Chiplets with 40K -600K LUTS
Related News
- The Era of Heterogeneous Integration Approaches: Who Shall Dominate the Advanced Packaging Field?
- SK hynix Signs Investment Agreement of Advanced Chip Packaging with Indiana
- SkyWater Names Bassel Haddad as Sr. Vice President and General Manager of Advanced Packaging
- SEMI and UCLA Offer Guide to Facilitate Onshoring Advanced Packaging Facilities in the United States
Latest News
- NAPMP announces chiplets R&D area
- Tenstorrent Expands Deployment of Arteris’ Network-on-Chip IP to Next-Generation of Chiplet-Based AI Solutions
- Arm's Data Center Advances: Chiplets, Efficiency & AI Integration
- Chiplets Make Progress Using Interconnects As Glue
- Alphawave Semi Selected for AI Innovation Research Grant from UK Government’s Advanced Research + Invention Agency