Chiplets: Where Are We Today?

The use of chiplet-based designs is expected to expand beyond high-performance parts to the broader market.

By  Barry Pangrle, Semi Enginnering (February 5th, 2025)

The 3^rd annual Chiplet Summit was held in Santa Clara from January 21^st to 23^rd at the Convention Center. The conference continues to grow from its 1^st year when it was held at the San Jose Doubletree Hotel (almost exactly 2 years ago). During his Chairman’s Welcome presentation, Chuck Sobey mentioned that there were 41 exhibitors at this year’s conference.

Chuck was also the moderator for the opening plenary session Chiplets: Where We Are Today. The speakers were Jim Handy of Objective Analysis and Jawad Nasrullah from Palo Alto Electron.

Jim Handy’s presentation was titled “The Chiplet Market Today and Where We’re Headed.” While people are familiar with Gordon Moore’s Law about the scaling of semiconductor integrated circuits made in his paper, “Cramming Components onto Integrated Circuits,” a lesser-known statement made in that very same paper claims, “It may prove to be more economical to build large systems out of smaller functions, which are separately packaged and interconnected.” So, the creator of Moore’s Law saw the possibility of a future with chiplet-based designs 60 years ago.

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