Silicon Box Celebrates Fourth Anniversary with Rapid Growth, New Milestones
SINGAPORE, June 30 2025 – Silicon Box, a leading semiconductor integration and advanced packaging company, celebrates its fourth anniversary with the publication of its founding story and company milestones.
Founded on a vision, four decades in the making, Silicon Box has achieved several industry milestones since its inception. As an industry pioneer in end-to-end technical expertise and capacity to deliver advanced packaging for next-gen semiconductors at scale, Silicon Box continues to expand its support for all customers that seek to differentiate their technology with the performance and cost efficiencies of chiplet-based solutions and sophisticated system integration requirements.
Record-breaking Industry Milestones
- Completed a 73,000 square-meter Singapore facility in just 11 months.
- Achieved volume production on our proprietary large-format SiPlet® process line within 3 months of factory opening and shipped to customers within 5 months.
- Raised $302.5 million in a Series B funding round, bringing the company’s valuation to $1.55 billion, and earning recognition as one of the fastest time-to-$1billion+ valuation for a semiconductor manufacturing company (< 3 years from founding).
“Our rapid progress is a testament to the dedication of our team and the trust of our partners in Silicon Box,” said Mike Han, Head of Business “We remain committed to advancing semiconductor innovation and supporting our customers who require advanced integration and packaging methods to break current technological limits, especially to enable future technologies like AI and advanced automation. Typical qualification and R&D times for semiconductor customers can exceed 2 years, and it will take commensurate time for our company’s revenues to fully reflect our sales pipeline, which is currently very robust.”
Key Company Highlights
- Revenue Growth: Reported revenue of $1.87 million in the first year of production at its Singapore factory (2024) from pre-qualified customers' production and R&D investments from major customers. This reflects strong market demand for advanced semiconductor development.
- Customer Demand: Doubled employee headcount to meet growing customer demand; net assets grew by 39.80 percent after a capital-intensive factory build and pilot line development in its first year.
- Market Expansion: Announced a second manufacturing facility in Novara, Italy, in the Region of Piedmont, to serve additional markets in Europe, supported by €1.3 billion Italian state aid approved by the European Commission.
“In capital-intensive industries like semiconductor manufacturing, bold strategically deployed front-loaded investments, are essential to building scale, infrastructure, and technological edge required to serve the sophisticated and growing demand for technological innovation”, added Hong Zhou Wong, Chief Financial Officer of Silicon Box. “Advanced manufacturing ventures like Silicon Box demand patient capital and conviction, as early capital outlays are followed by strong returns as utilization ramps up. Our investors are partners in our vision and understand the long-term value creation given the achievements we are making along the way.”
The road ahead
Despite a downturn in the industry cycle, Silicon Box’s rapid growth reflects the commitment of its customers, industry collaborators, partners, and investors. The company is dedicated to advancing the shared vision of its three co-founders, including CEO Dr. BJ Han; while honoring the legacy of its late co-founder Dr. Sehat Sutardja, by delivering better semiconductor innovations that are efficient, and sustainable for manufacturers, end-users and the planet.
Additionally, with backing from government grants and financial partners, Silicon Box has strengthened its foundation for expansion in Singapore, and global expansion with plans for a second manufacturing facility in Italy. Through significant investments in research and development, and continued development of its innovative SiPlet® technology, the company is positioned to capitalize on emerging industry trends, and the need for sustainable supply to meet the growing demand for advanced semiconductor packaging solutions.
About Silicon box
Silicon Box is an advanced semiconductor packaging company, specializing in cutting-edge integration technology and manufacturing processes. We offer solutions that enable chiplet architecture, as well as high-performance, affordable alternatives to traditional packaging schemes. Leveraging our proprietary technology, 30 years of multi-sectoral expertise, and relationships with best-in-class partners, we strive to solve the unique challenges of chiplet adoption to build the emergent technologies shaping the world around us today.
Silicon Box was founded in 2021 by Dr. Byung Joon (BJ) Han, Dr. Sehat Sutardja, and Weili Dai. Dr. Han was previously the Chairman, CEO and CTO of the world’s 3rd largest outsourced assembly and test provider, STATS ChipPAC (SSE: 600584) for two decades, taking the company to $4B in revenue during his tenure. Dr. Han is the inventor of many of the most advanced packaging solutions in today’s market, and his team at Silicon Box holds standing records for yield in advanced packaging technology at wafer-level production. Dr. Sutardja introduced the concept of chiplets at the International Solid State Circuits Conference (ISSCC) in 2015. He and Weili Dai founded Marvell Technology Group (NASDAQ: MRVL) in 1995 and ran the company for twenty years from a start-up to an over $50B market value company. To learn more about Silicon Box go to silicon-box.com
Related Chiplet
- 12nm EURYTION RFK1 - UCIe SP based Ka-Ku Band Chiplet Transceiver
- Interconnect Chiplet
- Bridglets
- Automotive AI Accelerator
- Direct Chiplet Interface
Related News
- TDK Ventures invests in Silicon Box and its revolutionary chiplet technology
- Silicon Box Accelerates Industry Leadership With Production Commencement at its World Leading Advanced Packaging Facility and Series B Fundraising
- Silicon Box’s Business Head on how chiplet architecture transforms semiconductor scalability
- Silicon Box breaks bottleneck in chiplet packaging with sub-5-micron technology
Latest News
- Silicon Box Celebrates Fourth Anniversary with Rapid Growth, New Milestones
- Novel Assembly Approaches For 3D Device Stacks
- Resonac and PulseForge Unite to Advance Photonic Debonding for Next-Gen Semiconductor Packaging
- Arm: Chiplets Can’t Deliver on TCO Without an Ecosystem
- Distributing Intelligence Inside Multi-Die Assemblies