Chiplets Still A Challenge With UCIe 2.0

New connectivity standard brings performance improvements and a bunch of new features, but it may take years before they are adopted — and still may not result in an open chiplet market.

By Brian Bailey, Semi Engineering (January 30, 2025)

Plug-and-play chiplets are a popular goal, but does UCIe 2.0 move us any closer to that becoming a reality? The problem is that the current drivers of the standard are not after interoperability in the way that plug-and-play requires.

Released in August 2024, UCIe 2.0 touts higher bandwidth density and improved power efficiency, as well as new features supporting 3D packaging, a manageable system architecture, and more. The standard is being driven by key industry leaders, including ASE, Alibaba, AMD, Arm, Google Cloud, Intel, Meta, Microsoft, NVIDIA, Qualcomm, Samsung Electronics, and TSMC.

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