How and Why Chiplets are Growing in Use and Need
By Ken Briodagh, Embedded Computing Design (May 6, 2024)
Ever since Gordon Moore made his eponymous prediction in 1965, it’s been inevitable that we would reach an end to the ability to keep doubling the processing in individual chips, if only because of the laws of physics (at the macro scale anyway – we’ll cover quantum computing another time!).
Since Moore has been so reliably correct, well beyond even the time when many early doomsayers said we’d hit the limits, mostly thanks to advancements in materials science and electrical engineering, there haven’t been many solutions presented to the problem of reaching that Moore horizon. In fact, many times when the topic comes up it’s not unusual to see shrugging shoulders and waved hands as the majority responses. If ain’t broke (yet), why fix it?
To read the full article, click here
Related Chiplet
- Interconnect Chiplet
- 12nm EURYTION RFK1 - UCIe SP based Ka-Ku Band Chiplet Transceiver
- Bridglets
- Automotive AI Accelerator
- Direct Chiplet Interface
Related News
- Chiplet market to hit US$411B by 2035, transforming semiconductor industry
- Chiplet Marketplace, Sustainability Top Discussions at OCP Summit
- YorChip and Digitho developing breakthrough 2D Chiplet Packaging for Mass Markets
- Chiplets Market to Reach USD 107.0 Billion by 2033; Amid Rising Demand for Advanced Semiconductor Solutions
Latest News
- Scintil Photonics Raises $58M to Scale Integrated Photonics for AI Factories
- Baya Systems Announces Addition of Visionary Technical Advisors and Renowned Executives
- ASML, Mistral AI enter strategic partnership
- EV Group Achieves Breakthrough in Hybrid Bonding Overlay Control for Chiplet Integration
- Asicland Marks First Anniversary of ‘Taiwan R&D Center’