How and Why Chiplets are Growing in Use and Need
By Ken Briodagh, Embedded Computing Design (May 6, 2024)
Ever since Gordon Moore made his eponymous prediction in 1965, it’s been inevitable that we would reach an end to the ability to keep doubling the processing in individual chips, if only because of the laws of physics (at the macro scale anyway – we’ll cover quantum computing another time!).
Since Moore has been so reliably correct, well beyond even the time when many early doomsayers said we’d hit the limits, mostly thanks to advancements in materials science and electrical engineering, there haven’t been many solutions presented to the problem of reaching that Moore horizon. In fact, many times when the topic comes up it’s not unusual to see shrugging shoulders and waved hands as the majority responses. If ain’t broke (yet), why fix it?
To read the full article, click here
Related Chiplet
- Direct Chiplet Interface
- HBM3e Advanced-packaging chiplet for all workloads
- UCIe AP based 8-bit 170-Gsps Chiplet Transceiver
- UCIe based 8-bit 48-Gsps Transceiver
- UCIe based 12-bit 12-Gsps Transceiver
Related News
- Expanding the Chiplet Market: Processing Any Wafer from Any Foundry
- Chiplet market to hit US$411B by 2035, transforming semiconductor industry
- Chiplet Marketplace, Sustainability Top Discussions at OCP Summit
- YorChip and Digitho developing breakthrough 2D Chiplet Packaging for Mass Markets
Latest News
- Why UCIe is Key to Connectivity for Next-Gen AI Chiplets
- 3M joins consortium to accelerate semiconductor technology in the US
- DeepSeek's Low-Cost AI Model to Spur Demand for Optical Communication, with Optical Transceiver Shipments Projected to Grow by 56.5% in 2025, Says TrendForce
- Chiplets: Where Are We Today?
- Assistant professor in electrical and computer engineering revolutionizes chiplet designs, earns NSF CAREER Award