Chiplet Marketplace, Sustainability Top Discussions at OCP Summit
By Nitin Dahad, EETimes (October 22, 2024)
The 2024 Open Compute Project Foundation (OCP) Global Summit drew some 7,000 visitors, and its success was apparent at registration: long lines of people trying to get their badges, no nearby parking if you were coming by car, and a packed show floor keen to learn about the latest initiatives from OCP members and exhibitors.
The main opening announcement from OCP was the expansion of its “Open Systems for AI Strategic Initiative,” with contributions from Nvidia with its MGX-based GB200-NVL72 platform and “in-progress contributions” from Meta. This specific community effort was launched in January 2024, with leadership provided by Intel, Microsoft, Google, Meta, NVIDIA, AMD, ARM, Ampere, Samsung, Seagate, SuperMicro, Dell, and Broadcom, with the objective being to establish commonalities and develop open standardizations for AI clusters and the data center facilities that host them.
To read the full article, click here
Related Chiplet
- Direct Chiplet Interface
- HBM3e Advanced-packaging chiplet for all workloads
- UCIe AP based 8-bit 170-Gsps Chiplet Transceiver
- UCIe based 8-bit 48-Gsps Transceiver
- UCIe based 12-bit 12-Gsps Transceiver
Related News
- SEMI 3D & Systems Summit to Spotlight Trends in Hybrid Bonding, Chiplet Design and Environmental Sustainability
- Chiplet Summit to Focus on New Packages and AI Applications in 2025
- Alphawave Semi ‘Redefines Connectivity’ in AI Hardware and Edge AI Summit 2024 Presentation on Chiplet Interconnects
- MSquare Technology Showcases Leadership in IP and Chiplet Innovation at the AI Hardware & Edge AI Summit
Latest News
- Why UCIe is Key to Connectivity for Next-Gen AI Chiplets
- 3M joins consortium to accelerate semiconductor technology in the US
- DeepSeek's Low-Cost AI Model to Spur Demand for Optical Communication, with Optical Transceiver Shipments Projected to Grow by 56.5% in 2025, Says TrendForce
- Chiplets: Where Are We Today?
- Assistant professor in electrical and computer engineering revolutionizes chiplet designs, earns NSF CAREER Award