Big Changes Ahead For Interposers And Substrates
New materials and processes will help with power distribution and thermal dissipation in advanced packages.
By Gregory Haley, Semi Engineering | March 24th, 2025
Interposers and substrates are undergoing a profound transformation from intermediaries to engineered platforms responsible for power distribution, thermal management, high-density interconnects, and signal integrity in the most advanced computing systems.
This shift is being driven by AI, high-performance computing (HPC), and next-generation communications, where the need for heterogeneous integration is pushing the limits of packaging technologies. While transistor dimensions have shrunk to the single-digit nanometer range, conventional PCB technology remains constrained to line widths of 20 to 30μm — a gap spanning three orders of magnitude.
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