Industry Standards for Chiplets and Their Role In Test
As the semiconductor industry increasingly moves to chiplets, 2.5D/3D packaging, and heterogeneous integration, there are significant new challenges for test. Leaders like Teradyne have the technologies necessary to respond and innovate, but to keep the industry running smoothly, we need effective collaboration, and that demands standardization.
There are multiple areas where standards are important in the test ecosystem, to enable efficient collaboration, encourage innovation, and improve test efficiency. At a high level, these standards all relate to the testing and communication protocols for integrated circuits (ICs) and semiconductor devices, enabling interoperability, data transfer, and reliability in advanced systems.
To read the full article, click here
Related Chiplet
- 12nm EURYTION RFK1 - UCIe SP based Ka-Ku Band Chiplet Transceiver
- Interconnect Chiplet
- Bridglets
- Automotive AI Accelerator
- Direct Chiplet Interface
Related Blogs
- The Need for Chiplets, and UCIe in Automotive
- Driving the Development and Deployment of Chiplets in the Automotive Industry
- Integrated Design Ecosystem™ for Chiplets and Heterogeneous Integration in Advanced Packaging Technology
- The Chiplet Center of Excellence sets new standards for the automotive industry
Latest Blogs
- AMI Outlines Full Support for Arm Total Design Chiplet Architecture to Custom Silicon Designers and Producers at APAC ATD Summit
- Faster, More Collaborative SoC and Chiplet Architecture Exploration: Introducing Synopsys Platform Architect Development Kit (PADK)
- Multi-Die Design Challenges: Industry Leaders Provide Insights and Guidance
- UCIe Full SI Analysis Flow with Compliance Check for Heterogeneous Integration
- Foundry 2.0 – the New Path Forward for Moore’s Law