Heterogeneous Integration: The future of semiconductor technology
Why is heterogenous integration considered a game changer for the next generation of semiconductor technology? In his interview with RealIZM, Erik Jung, Business Unit Developer at Fraunhofer IZM, gives an insight into the challenges faced by semiconductor manufacturers and research institutes trying to develop and make electronic components and systems with maximum performance.
Heterogeneous integration: What does the term actually mean?
Erik Jung: In heterogeneous integration, or hetero-integration for short, semiconductor components from different domains, e.g. optical, mechanical, or CMOS components, are combined – each from their optimized type of production – to achieve maximum performance. When we integrate them, we make sure that the paths between the individual functional units are kept so short that the signal latencies are as low as possible.
In the past, semiconductor components with different functions were often processed in a single – monolithic – production line. For example, high-frequency switches were integrated on a CMOS platform. Although this may be cost-effective, it is not optimal in terms of functionality or performance. This approach, called the system-on-chip (SoC), was promoted particularly in the field of cell phones. But it only really makes sense if the components’ performance and environmental requirements can be realized on a production line and the compromises that need to be made have no major impact on the system’s function. However, this case is becoming increasingly rare.
For higher-intensity transmissions, for example, more power must be dissipated via the system’s high-frequency section. This requires a different type of cooling. Power must also be supplied in a different way, for example from the rear. However, you cannot do this anymore with CMOS-based technology like a system-on-chip (SoC).
Is there a difference between the terms hetero-integration and hetero system integration?
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