The Growing Importance of Advanced Packaging in Europe – Recap of ERS TechTalk
Advanced packaging has emerged as a critical enabler of next-generation applications for artificial intelligence (AI), high-performance computing, wearables, 6G communication, and defense technologies. As traditional scaling approaches face increasing limitations, Advanced packaging enables further miniaturization and improved performance through heterogeneous integration, chip stacking, and high-density interconnects.
In Europe, advanced packaging has emerged as a strategic focus in the region’s ambition to build a resilient and self-sufficient semiconductor ecosystem. With significant investments under initiatives such as the European Chips Act, the goal is to drive semiconductor innovation, focusing on R&D, packaging and manufacturing to enhance Europe’s technological sovereignty and supply chain resilience.
Following the grand opening ceremony of our facility and Advanced Packaging Competence Centre in Barbing, Germany, we hosted a webinar on February 25th as a chance for an international audience to gain insights into the latest developments in advanced packaging in Europe.D
To read the full article, click here
Related Chiplet
- Automotive AI Accelerator
- Direct Chiplet Interface
- HBM3e Advanced-packaging chiplet for all workloads
- UCIe AP based 8-bit 170-Gsps Chiplet Transceiver
- UCIe based 8-bit 48-Gsps Transceiver
Related Blogs
- Integrated Design Ecosystem™ for Chiplets and Heterogeneous Integration in Advanced Packaging Technology
- Extending Moore’s Law via high-end packaging and advanced IC substrates
- TSMC Advanced Packaging Overcomes the Complexities of Multi-Die Design
- Semiconductors supply chain ecosystem for advanced packaging
Latest Blogs
- The Growing Importance of Advanced Packaging in Europe – Recap of ERS TechTalk
- Cadence Silicon Success of UCIe IP on Samsung Foundry’s 5nm Automotive Process
- Ayar Labs Optical Connectivity for AI Compute Fabrics
- The APECS Pilot Line: Heterointegration enabling Chiplet Applications
- The Future of Faster, Smaller, and More Efficient Chips: A Breakthrough in Hybrid Bonding