Direct Chiplet Interface
Multiple standard Die to Die interface implementations are present in the market, with additional implementations in development. Add the proprietary implementations already in use, and the issue of using chiplets that implement different D2D interfaces in the same design surfaces. CrossFire’s solution to this issue is a small Chiplet that we call a “Bridgelet™”. For example, a Bridgelet could interface between two Chiplets that use different Die to Die interfaces.
CrossFire’s first Bridgelet will be a DCI to UCIe device. This device will enable CrossFire customers that have integrated DCI connectivity into their Chiplets to connect to Chiplets equipped with the standard high power, low density UCIe interface.
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- See the entire Direct Chiplet Interface datasheet
- Get in contact with Direct Chiplet Interface Supplier
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