IMDD Tx PICs
- Reliable & qualified
- Supports single or dual input laser to drive all 8-channels
- CMOS-level drive voltage, featuring our patented ultra-low drive voltage design
- > 110 GHz electro-optic bandwidth
The reference hub for the chiplet ecosystem
Where the chiplet marketplace starts with trust.
New Chiplets
Near-Packaged Optics (NPO) Chiplet Solution
- CPO/NPO connectivity for GPU/Switch/ASIC with integrated OSPic™ all-optical signal processor
- High capacity, low latency up to 10Tbps for scale out CPO
- From 1.6Tbps to 6.4Tbps NPO in-field serviceability with heterogeneous laser integration
12nm EURYTION RFK1 - UCIe SP based Ka-Ku Band Chiplet Transceiver
- UCIe based Ka/Ku band transceiver
- Wide Bandwidth
- Scalable solution for dense mm-wave radio into single multi-chip modules
Interconnect Chiplet
- Integrates 16 complete UCIe modules, following the standard UCIe 1.1 standard
- Integrates one complete HBM3 IP, including the controller and PHY, following the HBM3 JESD238 standard
Automotive AI Accelerator
- Eagle-N, the first of Eagle Chiplet SoC Family is an Automotive AI Accelerator which is a unique product in the market targeting IVI and ADAS acceleration based on PCIe interface or UCIe interface with host AP.
HBM3e Advanced-packaging chiplet for all workloads
- Scalable AI, fortified with high compute density and ample memory bandwidth
New Chiplet-Ready IP
High Performance Droplet
- High-Performance Analog Front-Ends (AFEs): Essential for data acquisition and signal processing in various applications.
- High-Speed Interfaces: Facilitating seamless communication between solutions. Omni Design supports various standards, including JESD204 and PCIe.
- Custom Solutions: Omni Design can tailor SoC solutions to meet specific customer requirements.
12nm EURYTION RFK1 - UCIe SP based Ka-Ku Band Chiplet Transceiver
- UCIe based Ka/Ku band transceiver
- Wide Bandwidth
- Scalable solution for dense mm-wave radio into single multi-chip modules
UCIe AP based 8-bit 170-Gsps Chiplet Transceiver
- 2T2R chiplet configuration
- 160/175-GSa/s sample rate
- 7-bit resolution
100G optical I/O chiplets
- RANOVUS®’ Odin® optical I/O cores set industry benchmarks for high bandwidth, low power consumption and small size for AI, cloud, metaverse, and communications applications
Memory Chiplet
- Stealth Mode Products design to disrupt AI/Generative AI processing.
Insights
Ecosystem Highlights
聯電取得imec iSiPP300矽光子技術授權 布局下世代高速通訊
2025-12-08T07:03:00+00:00
创新协作，合见工软与北京芯力共筑芯粒技术产业新生态
2026-01-28T01:44:44+00:00
创意电子与AyarLabs携手推进超大规模运算的Co-PackagedOptics技术
2025-11-17T06:50:00+00:00
YES獲得一流記憶體供應商的多筆VeroTherm™和VeroFlex™系統訂單
2025-09-30T06:19:00+00:00
Resonac創設27家企業組成的「JOINT3」聯盟以開發下一代半導體封裝技術
2025-09-03T09:43:00+00:00
Expert Perspectives
破局 AI 算力困局：3D-IC 技术架构的颠覆性变革
January 28, 2026
Chiplet将颠覆两巨头？
January 15, 2024
Recent Updates
Ecosystem & Strategy
聯電取得imec iSiPP300矽光子技術授權 布局下世代高速通訊
2025-12-08T07:03:00+00:00
Business & Deals
创新协作，合见工软与北京芯力共筑芯粒技术产业新生态
2026-01-28T01:44:44+00:00
Interconnects & Integration
创意电子与AyarLabs携手推进超大规模运算的Co-PackagedOptics技术
2025-11-17T06:50:00+00:00
Interconnects & Integration
领先的AI基础设施供应商选择YES为其玻璃基板AI与HPC应用提供全系列先进封装工具
2025-10-22T05:33:00+00:00
Manufacturing & Supply Chain
YES獲得一流記憶體供應商的多筆VeroTherm™和VeroFlex™系統訂單
2025-09-30T06:19:00+00:00
Interconnects & Integration
Resonac創設27家企業組成的「JOINT3」聯盟以開發下一代半導體封裝技術
2025-09-03T09:43:00+00:00