Direct Chiplet Interface
- This device will enable CrossFire customers that have integrated DCI connectivity into their Chiplets to connect to Chiplets equipped with the standard high power, low density UCIe interface.
Chiplet Marketplace
Chiplet Marketplace is the world's most comprehensive Chiplet resource with over 200 Chiplets from 20 vendors and foundries
New Chiplet
HBM3e Advanced-packaging chiplet for all workloads
- Scalable AI, fortified with high compute density and ample memory bandwidth
High-Density Electronic-Photonic Chiplet
- Parallel electrical interface
- Supports AIB and other proprietary parallel interfaces
- 8 full-duplex optical ports
UCIe AP based 8-bit 170-Gsps Chiplet Transceiver
- 2T2R chiplet configuration
- 160/175-GSa/s sample rate
- 7-bit resolution
UCIe based 8-bit 48-Gsps Transceiver
- 48-Gsps peak sample rate
- 8 bit resolution
- UCIe SP (16x lanes at 16Gbps) with streaming controller
UCIe based 12-bit 12-Gsps Transceiver
- 12-Gsps peak sample rate
- 12 bit resolution (programmable)
- UCIe SP (16x lanes at 16Gbps) with streaming controller
Parallel Single Mode (PSM) 16-channel 112 Gbps Transmitter Chiplet
- 16x DR4 specification compliant transmit channels including modulator and driver
- Digital SPI control interface
Active silicon interposer
- Network-On-Interposer
- 4 Tbps aggregate bisection bandwidth
100G optical I/O chiplets
- RANOVUS®’ Odin® optical I/O cores set industry benchmarks for high bandwidth, low power consumption and small size for AI, cloud, metaverse, and communications applications
Memory Chiplet
- Stealth Mode Products design to disrupt AI/Generative AI processing.
Featured News
突破先进封装壁垒：智原科技携手奇异摩尔合作的2.5D封装平台成功进入量产阶段
2024-10-08T08:39:00+02:00
GUC 宣布 CSP 資料中心採用 HBM3E IP
2024-09-24T11:40:00+02:00
智原推出先进封装合作平台 支持多源小芯片封装整合
2024-09-10T08:45:00+02:00
新思科技发布全球领先的40G UCIe IP，助力多芯片系统设计全面提速
2024-09-10T07:05:00+02:00
Tenstorrent 与 Movellus 达成战略合作，共同开发下一代基于芯粒的 AI 和 HPC 解决方案
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突破先进封装壁垒：智原科技携手奇异摩尔合作的2.5D封装平台成功进入量产阶段
2024-10-08T08:39:00+02:00
GUC 宣布 CSP 資料中心採用 HBM3E IP
2024-09-24T11:40:00+02:00
智原推出先进封装合作平台 支持多源小芯片封装整合
2024-09-10T08:45:00+02:00
新思科技发布全球领先的40G UCIe IP，助力多芯片系统设计全面提速
2024-09-10T07:05:00+02:00
Tenstorrent 与 Movellus 达成战略合作，共同开发下一代基于芯粒的 AI 和 HPC 解决方案
2024-09-09T14:25:00+02:00
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