High-performance connectivity chiplets

High-performance connectivity for scalable AI systems

The TYL.IO chiplet is the first in the TYLsemi family of connectivity chiplets, delivering latest generation PCIe and CXL-based high-bandwidth, low-latency connectivity across multi-die systems. It enables efficient communications between compute, memory, and networking elements, establishing a reusable foundation for system-level data movement, with additional chiplets extending coverage to further interconnect standards and application domains.

As AI architectures shift to chiplet-based designs, given analog and IO devices are not scaling with process nodes, IO connectivity becomes a critical bottleneck for performance, power efficiency, and system integration.

The TYL.IO chiplet addresses this with a standards-based, production-ready solution that removes the need to design and validate IO connectivity for every program. With an IO chiplet-based design, customers can upgrade IO connectivity independent of their existing compute silicon, enabling newer PCIe generations without a full redesign and reducing networking overhead across the rack.