The chiplet universe is coming: What’s in it for you?
By Guillaume Boillet, Arteris
EDN (February 21, 2024)
There’s a lot of talk and excitement about chiplets these days, but there’s also a lot of confusion. What is available today? What should I expect in terms of interoperability? Is the promise of an emerging ecosystem real? More fundamentally, developers of high-end systems-on-chip (SoCs) need to consider a central question: “What’s in it for me?” The answer, unsurprisingly, varies depending on the type of application and the target market for these devices.
For the last few years, I have been closely monitoring the multi-die market, and I’ve been talking to a wide variety of players ranging from chip designers to chip manufacturers to end users of our system IP product offering. Although commentators and stakeholders accurately describe key benefits of chiplet technology, I’ve observed that these descriptions are rarely comprehensive and often lack structure.
As a result, I felt the need to identify common themes, reflect on their importance for future deployment and map them on the key industry verticals. This blog aims to summarize these insights in a diagram, with the hope that it is useful to you.
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