Chiplet Technology: Revolutionizing Semiconductor Design - A Review
By Vivek Gujar, Director, IndoAI Technologies Pvt. Ltd.
This article explores the transformative journey of semiconductor design from monolithic structures to the cutting-edge era of chiplets. Chiplets, modular components offering specific functionalities, have emerged as a catalyst, reshaping the global semiconductor industry. Their capacity for tight interconnectivity, diverse applications, and cost-effective manufacturing marks a paradigm shift. The article delves into the historical context of Moore's Law, the rise of chiplets, and their impact on the semiconductor landscape. It further discusses key considerations in chiplet architecture, optimization algorithms, and future adoption in industries like data centers, mobile devices, AI, and automotive. Chiplet-based designs promise enhanced efficiency, collaboration, and innovation, heralding a new era in semiconductor evolution.
To read the full article, click here
Related Chiplet
- Interconnect Chiplet
- 12nm EURYTION RFK1 - UCIe SP based Ka-Ku Band Chiplet Transceiver
- Bridglets
- Automotive AI Accelerator
- Direct Chiplet Interface
Related Technical Papers
- ATSim: A Fast and Accurate Simulation Framework for 2.5D/3D Chiplet Thermal Design Optimization
- RapidChiplet: A Toolchain for Rapid Design Space Exploration of Chiplet Architectures
- Securing the new chiplet era of semiconductor design
- Optimized Low Parasitic Capacitance ESD Clamps for High-Bandwidth 2.5D/3D Chiplet Interfaces in Advanced FinFET Technology
Latest Technical Papers
- LEGOSim: A Unified Parallel Simulation Framework for Multi-chiplet Heterogeneous Integration
- 3D Stacked HBM and Compute Accelerators for LLM: Optimizing Thermal Management and Power Delivery Efficiency
- Monolithically Integrated Optical Through-Silicon Waveguides for 3D Chip-to-Chip Photonic Interconnects
- Mozart: A Chiplet Ecosystem-Accelerator Codesign Framework for Composable Bespoke Application Specific Integrated Circuits
- On-Package Memory with Universal Chiplet Interconnect Express (UCIe): A Low Power, High Bandwidth, Low Latency and Low Cost Approach