Surface codes and modular chiplets in the presence of defects

By Sophia Lin (University of Chicago)

Fabrication errors pose a significant challenge in scaling up solid-state quantum devices to the sizes required for fault-tolerant quantum applications. In this talk I will present the paper, “Codesign of quantum error-correcting codes and modular chiplets in the presence of defects”, which combines two approaches to mitigate the resource overhead caused by fabrication errors: (1) leveraging the flexibility of a modular architecture, (2) adapting the procedure of quantum error correction to account for fabrication defects. As an extension to this topic, I hope to start a discussion on how fabrication errors affect the performance and resource overhead of other codes.