Electronica 2024 - Shaping the Future of Automotive Electronics with Chiplets and Sustainability By Bart Placklé, Imec November 19, 2024
UCIe 2.0 Specification: Advancing an open ecosystem for on-package chiplet innovation By Debendra Das Sharma, Intel November 18, 2024
Accelerating AI Innovation with Arm Total Design: A Case Study By Imran Yusuf (Arm) and Kelvin Low (Samsung) November 14, 2024
From Internal Designs to Open Chiplet Economy: Discussion on How to Create Open, Democratized Access to Chiplet Technology By Arvind Kumar, Clint Walker, Nilesh Shah, Raj Uppala anf Jack Guedj November 4, 2024
Impact of Chiplets, Heterogeneous Integration and Modularity on AI and HPC systems By Ramin Farjadrad, William Chen, Prith Banerjee, Dave Ditzel and Cesc Guim October 30, 2024
Enabling AI Capability Through Chiplet Architecture By Balaji Baktha, CEO and founder of Ventana Micro Systems October 29, 2024
Revolutionizing System Design: Impact of Chiplets and Heterogeneous Integration on AI Server By Mudit Khasgiwala, Applied Materials October 28, 2024
Enabling the Open Chiplet Economy: 3D IC Design Kits (3DK) in Action By David Ratchkov (Anemoi Software), James Wong (Palo Alto Electron) October 25, 2024
BoW PHY 2.1 By Kevin Donnelly (Eliyan), Kash Johal (Yorchip) and Shahab Ardalan (Enosemi) October 24, 2024
Chiplet interoperability and breakthroughs in AI By Francisco Soca, Arm and Jonathon Evans, Nvidia October 24, 2024
D2D Chiplet Based SiP Testing Challenges and Solutions By Rajesh Pendurkar, Capgemini Engineering and Aparna Tard, Synopsys October 24, 2024
On the road to automotive chiplets By Kurt Herremans (Program Director Automotive) - Imec October 24, 2024
Architecting Next Generation Compute and I/O Chiplet for AI/ML, Cloud and Edge Platforms By Sue Hung Fung, AlphaWave Semi and Sridhar Valluru, Arm October 23, 2024
Blue Cheetah BlueLynx for Heterogeneous Integration: 16 Gbps Chiplet Interconnect IP for UCIe & BoW By Marc Greenberg October 21, 2024