From the Shadows to the Spotlight – Probe’s Role in Enabling Electronics Industry Innovation

By Mike Slessor, CEO at FormFactor Inc.

December 17, 2024

A Deep Dive into UCIe-3D

By Zuoguo (Joe) Wu, UCIe Consortium Electrical Working Group Co-Chair and Sr Principal Engineer at Intel

December 13, 2024

MIPI Debug Webinar Series: A Preview of MIPI Debug Over UCIe

By Aruni Nelson, Peter Onufryk

December 12, 2024

Traceability and Security for Chiplet Supply Chain

By Jun Kawaguchi, Winbond

December 10, 2024

The Great Verification Chiplet Challenge

By DVCon Europe 2023 Panel

December 5, 2024

MSquare Technology: Enabling Packaging and Interconnect Chiplet IP

By Sean Wang, MSquare Technology

November 28, 2024

Exploring CXL Memory Disaggregation: Use Cases and System Benefits

By Jungmin Choi, SK hynix

November 27, 2024

Photonic Fabric for AI interconnect

By Uday Poosarla - Celestial AI

November 27, 2024

GSCM 2024: Interview with A.M. Fitzgerald and Associates' Alissa Fitzgerald

By Alissa Fitzgerald, AMFitzgerald

November 22, 2024

Electronica 2024 - Shaping the Future of Automotive Electronics with Chiplets and Sustainability

By Bart Placklé, Imec

November 19, 2024

UCIe 2.0 Specification: Advancing an open ecosystem for on-package chiplet innovation

By Debendra Das Sharma, Intel

November 18, 2024

Accelerating AI Innovation with Arm Total Design: A Case Study

By Imran Yusuf (Arm) and Kelvin Low (Samsung)

November 14, 2024

The Rise of The Hublet™ & FPGA Chiplets

By Primemas, Achronix and Blue Cheetah

November 8, 2024

From Internal Designs to Open Chiplet Economy: Discussion on How to Create Open, Democratized Access to Chiplet Technology

By Arvind Kumar, Clint Walker, Nilesh Shah, Raj Uppala anf Jack Guedj

November 4, 2024

“Dating” and “Marrying”: An AI Chiplet’s Perspective

By Arvind Kumar, IBM Research

October 31, 2024

Impact of Chiplets, Heterogeneous Integration and Modularity on AI and HPC systems

By Ramin Farjadrad, William Chen, Prith Banerjee, Dave Ditzel and Cesc Guim

October 30, 2024

Bapiraju Vinnakota: Chiplets Ecosystem

By Bapiraju Vinnakota

October 30, 2024

Enabling AI Capability Through Chiplet Architecture

By Balaji Baktha, CEO and founder of Ventana Micro Systems

October 29, 2024

Revolutionizing System Design: Impact of Chiplets and Heterogeneous Integration on AI Server

By Mudit Khasgiwala, Applied Materials

October 28, 2024

Enabling the Open Chiplet Economy: 3D IC Design Kits (3DK) in Action

By David Ratchkov (Anemoi Software), James Wong (Palo Alto Electron)

October 25, 2024