Thinking Big: From Chips To Systems
By Ed Sperling, Semiconductor Engineering (February 27, 2024 )
Multi-die systems require new tools, technologies, and some very different approaches to design automation.
Semiconductor Engineering sat down with Aart de Geus, executive chair and founder of Synopsys, to talk about the shift from chips to systems, next-generation transistors, and what’s required to build multi-die devices in the context of rapid change and other systems.
To read the full article, click here
Related Chiplet
- Direct Chiplet Interface
- HBM3e Advanced-packaging chiplet for all workloads
- UCIe AP based 8-bit 170-Gsps Chiplet Transceiver
- UCIe based 8-bit 48-Gsps Transceiver
- UCIe based 12-bit 12-Gsps Transceiver
Related News
- EdgeCortix Receives 4 Billion Yen Subsidy from Japan’s NEDO to Advance Energy-Efficient AI Chiplets for Post-5G Communication Systems
- U.S. Navy Funds Mercury to Advance Chip-Scale Technologies Needed to Reduce Electronic Warfare Design Timelines
- Biden-Harris Administration Announces Over $5 Billion from the CHIPS and Science Act for Research, Development, and Workforce
- Chiplet Interconnect Pioneer Eliyan Closes $60 Million Series B Funding Round, Co-led by Samsung Catalyst Fund and Tiger Global Management to Address Most Pressing Challenge in Development of Generative AI Chips
Latest News
- Arm Chiplet System Architecture Makes New Strides in Accelerating the Evolution of Silicon
- Numem Overcomes AI Performance Barriers with Next-Gen Memory Solutions, Highlights Innovations at Chiplet Summit
- Blue Cheetah Tapes Out Its High-Performance Chiplet Interconnect IP on Samsung Foundry SF4X
- Alphawave Semi to Lead Chiplet Innovation, Showcase Advanced Technologies at Chiplet Summit
- YorChip announces patent-pending Universal PHY for Open Chiplets