Thinking Big: From Chips To Systems
By Ed Sperling, Semiconductor Engineering (February 27, 2024 )
Multi-die systems require new tools, technologies, and some very different approaches to design automation.
Semiconductor Engineering sat down with Aart de Geus, executive chair and founder of Synopsys, to talk about the shift from chips to systems, next-generation transistors, and what’s required to build multi-die devices in the context of rapid change and other systems.
To read the full article, click here
Related Chiplet
- Interconnect Chiplet
- 12nm EURYTION RFK1 - UCIe SP based Ka-Ku Band Chiplet Transceiver
- Bridglets
- Automotive AI Accelerator
- Direct Chiplet Interface
Related News
- Broadcom Bets on 3.5D Packaging Technology to Build Bigger AI Chips
- Biden-Harris Administration Announces Over $5 Billion from the CHIPS and Science Act for Research, Development, and Workforce
- EdgeCortix Receives 4 Billion Yen Subsidy from Japan’s NEDO to Advance Energy-Efficient AI Chiplets for Post-5G Communication Systems
- Ayar Labs, with Investments from AMD, Intel Capital, and NVIDIA, Secures $155 million to Address Urgent Need for Scalable, Cost-Effective AI Infrastructure
Latest News
- Socionext and imec Update Core Partner Program
- TCS Unveils Chiplet-Based System Engineering Services to Accelerate Semiconductor Innovation
- Deca and Silicon Storage Technology Announce Strategic Collaboration to Enable NVM Chiplet Solutions
- Lam Research Introduces VECTOR® TEOS 3D to Address Critical Advanced Packaging Challenges in Chipmaking
- Scintil Photonics Raises $58M to Scale Integrated Photonics for AI Factories