French AI chiplet boost for open source Nvidia accelerator
French startup Neurxcore has launched a Neural Processor Units (NPU) AI chiplet built on an enhanced version of the open source Nvidia Deep Learning Accelerator technology.
By Nick Flaherty, eeNews Europe (October 19, 2023)
The SNVDLA IP series from Neurxcore in Grenoble is aimed at image processing, including classification and object detection from wearables to the data centre. Depending on configuration, this can be more than 100 times faster than a GPU for AI acceleration and 1000 times faster than a CPU.
Neurxcore processors combine patented proprietary technologies with Nvidia’ open acceleration core. These neural processors are offered as licenses, which means that customers can use them in their own designs. Initially the Neurxcore processors will be available as chiplets that can be combined with CPU, memory and communications in a system in a package. This gives more flexibility by allowing the combination of different manufacturing processes, while optimizing costs in terms of density, integration and scalability says the company.
To read the full article, click here
Related Chiplet
- 12nm EURYTION RFK1 - UCIe SP based Ka-Ku Band Chiplet Transceiver
- Interconnect Chiplet
- Bridglets
- Automotive AI Accelerator
- Direct Chiplet Interface
Related News
- BOS and Tenstorrent Unveil Eagle-N, Industry’s First Automotive AI Accelerator Chiplet SoC
- Alphawave Semi Drives Innovation in Hyperscale AI Accelerators with Advanced I/O Chiplet for Rebellions Inc
- Alphawave Semi Tapes Out Industry-First, Multi-Protocol I/O Connectivity Chiplet for High-Performance Compute and AI Infrastructure
- Alphawave Semi’s quest for open chiplet ecosystem
Latest News
- Analogue Insight and Tetrivis Announce Joint Development of “Eurytion RFK1”, a UCIe based 12 nm Ka/Ku-Band RF Chiplet Transceiver
- Powering AI with Chiplet Innovation: MSquare's ML100 IO Die Live at COMPUTEX 2025
- Advanced IC Packaging: The Roadmap to 3D IC Semiconductor Scaling
- India’s OSAT Ambitions: Flying High or a Flight Risk?
- Deca Announces Agreement with IBM to Bring High-Density Fan-Out Interposer Production to North America