Femtosense Combines AI Chiplet with MCU for Audio SiP
By Sally Ward-Foxton, EETimes (Augutst 7, 2024)
Silicon Valley AI chip startup Femtosense has partnered with South Korean microcontroller maker ABOV Semiconductor to make a system-in-package featuring Femtosense’s low-power AI accelerator chiplet, the sparsity processing unit (SPU), with ABOV’s Arm Cortex-M0+ microcontroller chiplet. Both companies will market and sell the new AI MCU in audio applications, particularly consumer electronics and white goods that require low-cost, low-power voice control.
Femtosense partnered with ABOV in part due to the Korean firm’s links to Samsung, Femtosense CEO Sam Fok told EE Times.
To read the full article, click here
Related Chiplet
- Interconnect Chiplet
- 12nm EURYTION RFK1 - UCIe SP based Ka-Ku Band Chiplet Transceiver
- Bridglets
- Automotive AI Accelerator
- Direct Chiplet Interface
Related News
- Chiplet interconnect pioneer Eliyan gains additional financial backing from AI chip ecosystem with strategic investment from VentureTech Alliance
- Alphawave Semi ‘Redefines Connectivity’ in AI Hardware and Edge AI Summit 2024 Presentation on Chiplet Interconnects
- MSquare Technology Showcases Leadership in IP and Chiplet Innovation at the AI Hardware & Edge AI Summit
- ADTechnology Partners with Arm, Samsung Foundry, and Rebellions on AI CPU Chiplet Platform
Latest News
- Silicon 100: Chiplet work spanning interconnect PHYs to smart substrates
- Syenta Raises A$8.8M to Break AI’s Memory Wall with Next-Gen Chip Packaging Technology
- ASICLAND Initiates Two Chiplet SoC Development Contracts with Primemas Worth a Total of KRW 16 Billion
- OKI Develops Tiling crystal film bonding (CFB) Technology for Heterogeneous Integration of Optical Semiconductors onto 300 mm Silicon Wafers
- Cadence Accelerates Development of Billion-Gate AI Designs with Innovative Power Analysis Technology Built on NVIDIA