Metrology And Inspection For The Chiplet Era
Recent developments address imminent needs of advanced nodes and packages, but not all the pieces are in place yet.
By Gregory Haley, Semiconductor Engineering (August 6th, 2024)
New developments and innovations in metrology and inspection will enable chipmakers to identify and address defects faster and with greater accuracy than ever before, all of which will be required at future process nodes and in densely-packed assemblies of chiplets.
These advances will affect both front-end and back-end processes, providing increased precision and efficiency, combined with artificial intelligence/machine learning and big data analytics. These kinds of improvements will be crucial for meeting the industry’s changing needs, enabling deeper insights and more accurate measurements at rates suitable for high-volume manufacturing. But gaps still need to be filled, and new ones are likely to show up as new nodes and processes are rolled out.
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