Glass substrate alliance for AI chiplets
By Nick Flaherty, eeNews Europe (September 6, 2024)
An alliance of companies is aiming to boost the use of glass substrates for more complex AI chips and chiplets.
The E-Core Alliance is led by E&R Engineering in Taiwan and brings together over 15 companies to boost the development of large glass substrates.
With the rapid growth in demand for AI chips, high-frequency, and high-speed communication devices, glass substrates in advanced packaging technologies are becoming increasingly important. Compared to the widespread use of copper foil substrates, glass substrates offer higher wiring density and better signal performance. Additionally, glass provides high flatness and can withstand high temperatures and voltages, making it an ideal replacement for traditional substrates.
Companies such as Intel have been looking at glass substrates for chiplet packaging and there is CHIPS Act funding in the US for the development of glass substrates.
To read the full article, click here
Related Chiplet
- 12nm EURYTION RFK1 - UCIe SP based Ka-Ku Band Chiplet Transceiver
- Interconnect Chiplet
- Bridglets
- Automotive AI Accelerator
- Direct Chiplet Interface
Related News
- Glass, chiplets will propel advanced IC substrate market, says Yole
- Alphawave Semi and Arm to Present on Chiplets for Architecting Next-Generation Terabit AI Networks at the TSMC OIP Ecosystem Forum North America
- EdgeCortix Receives 4 Billion Yen Subsidy from Japan’s NEDO to Advance Energy-Efficient AI Chiplets for Post-5G Communication Systems
- DreamBig Semiconductor Announces Partnership with Samsung Foundry to Launch Chiplets for World Leading MARS Chiplet Platform on 4nm FinFET Process Technology Featuring 3D HBM Integration to Solve Scale-up and Scale-out Limitations of AI for the Masses
Latest News
- Tenstorrent’s Blue Cheetah deal a harbinger of chiplet acquisition spree
- Tenstorrent Acquires Blue Cheetah Analog Design
- Silicon Box Celebrates Fourth Anniversary with Rapid Growth, New Milestones
- Novel Assembly Approaches For 3D Device Stacks
- Resonac and PulseForge Unite to Advance Photonic Debonding for Next-Gen Semiconductor Packaging