Glass substrate alliance for AI chiplets
By Nick Flaherty, eeNews Europe (September 6, 2024)
An alliance of companies is aiming to boost the use of glass substrates for more complex AI chips and chiplets.
The E-Core Alliance is led by E&R Engineering in Taiwan and brings together over 15 companies to boost the development of large glass substrates.
With the rapid growth in demand for AI chips, high-frequency, and high-speed communication devices, glass substrates in advanced packaging technologies are becoming increasingly important. Compared to the widespread use of copper foil substrates, glass substrates offer higher wiring density and better signal performance. Additionally, glass provides high flatness and can withstand high temperatures and voltages, making it an ideal replacement for traditional substrates.
Companies such as Intel have been looking at glass substrates for chiplet packaging and there is CHIPS Act funding in the US for the development of glass substrates.
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