Glass, chiplets will propel advanced IC substrate market, says Yole
By Peter Clarke, eeNews Europe (September 9, 2024)
The advanced IC substrate market is set to be worth US16.6 billion in 2024 and enjoy a compound annual growth rate (CAGR) of 9 percent over the period 2024 to 2029, according to Yole Group.
The competition to commercialize glass-cored substrates – which resist warping under heat – is intensifying as more players enter the field, the analyst said. Yole lists startup Absolics, Intel and Samsung among the key players.
The growth that is forecast will be driven by rising demand for flip-chip ball grid array substrates and 2.5D/3D advanced packages. This demand is across a broad front including high-performance computing and data centers, 5G, CPUs and XPUs for AI personal computers and automotive sectors.
To read the full article, click here
Related Chiplet
- Direct Chiplet Interface
- HBM3e Advanced-packaging chiplet for all workloads
- UCIe AP based 8-bit 170-Gsps Chiplet Transceiver
- UCIe based 8-bit 48-Gsps Transceiver
- UCIe based 12-bit 12-Gsps Transceiver
Related News
- Chiplets Market to Reach USD 107.0 Billion by 2033; Amid Rising Demand for Advanced Semiconductor Solutions
- Biden-Harris Administration Announces Preliminary Terms with Absolics to Support Development of Glass Substrate Technology for Semiconductor Advanced Packaging
- Glass substrate alliance for AI chiplets
- KLA Unveils Comprehensive IC Substrate Portfolio for a New Era of Advanced Semiconductor Packaging
Latest News
- Alphawave Semi Scales UCIe™ to 64 Gbps Enabling >20 Tbps/mm Bandwidth Density for Die-to-Die Chiplet Connectivity
- Silicon Box welcomes European Commission approval of €1.3 billion Italian State aid measure to support new advanced packaging facility in Novara
- Fraunhofer IMS Takes a Key Role in Establishing the APECS Pilot Line
- EdgeCortix Joins AI-RAN Alliance to Accelerate the Integration of AI and Next-gen RAN Infrastructure
- Cadence Rolls Out System Chiplet to Reorganize the SoC