Chiplets drive new automated design tools at Leti
By Nick Flaherty, eeNews Europe (June 26, 2024)
CEA-Leti has shown a scalable chiplet architecture for automotive and developed new automated tools for design exploration.
The move to software defined vehicles and zonal architectures is also driving the need for chiplets and new design tools at French research group Leti in Grenoble.
“Two years ago we started a feasibility study with a big automotive OEM to define and specify the high level architecture of E/E architectures and at that time there were only two solutions: a SDV based on a GPU and a discrete solution,” said Denis Dutoit, programme manager for advanced computing and chiplets at CEA-Leti.
This chiplet architecture was described at the Leti Innovation Day today.
“This architecture will require a new design methodology as the design space is so huge the traditional way of designing system is no longer valid,” he said.
To read the full article, click here
Related Chiplet
- 12nm EURYTION RFK1 - UCIe SP based Ka-Ku Band Chiplet Transceiver
- Interconnect Chiplet
- Bridglets
- Automotive AI Accelerator
- Direct Chiplet Interface
Related News
- Chiplets diary: Three anecdotes recount design progress
- Why chiplets will transform electronic system design
- CEA-Leti Develops Active Optical Interposers to Connect Chiplets
- Chiplets: Revolutionizing Semiconductor Design and Manufacturing
Latest News
- Arm Reportedly Weighs Chiplet and Solution Development, Raising Customer Tensions
- SiMa.ai Expands Strategic Collaboration with Synopsys to Accelerate Automotive AI Innovation
- When Standards Enable Chiplets
- Multibeam Secures $31 Million in Series B Financing to Accelerate Global Deployment of E-Beam Lithography Production Solutions
- Alphawave Semi Highlights Why the Next Generation of AI Advances Demand Chiplet Architectures at EE Times: The Future of Chiplets