Chiplets drive new automated design tools at Leti
By Nick Flaherty, eeNews Europe (June 26, 2024)
CEA-Leti has shown a scalable chiplet architecture for automotive and developed new automated tools for design exploration.
The move to software defined vehicles and zonal architectures is also driving the need for chiplets and new design tools at French research group Leti in Grenoble.
“Two years ago we started a feasibility study with a big automotive OEM to define and specify the high level architecture of E/E architectures and at that time there were only two solutions: a SDV based on a GPU and a discrete solution,” said Denis Dutoit, programme manager for advanced computing and chiplets at CEA-Leti.
This chiplet architecture was described at the Leti Innovation Day today.
“This architecture will require a new design methodology as the design space is so huge the traditional way of designing system is no longer valid,” he said.
Related Chiplet
- Direct Chiplet Interface
- HBM3e Advanced-packaging chiplet for all workloads
- UCIe AP based 8-bit 170-Gsps Chiplet Transceiver
- UCIe based 8-bit 48-Gsps Transceiver
- UCIe based 12-bit 12-Gsps Transceiver
Related News
- Chiplets diary: Three anecdotes recount design progress
- Why chiplets will transform electronic system design
- CEA-Leti Develops Active Optical Interposers to Connect Chiplets
- Chiplets: Revolutionizing Semiconductor Design and Manufacturing
Latest News
- Pre-Registration Opens for Chiplet Summit
- ASU and Deca Technologies selected to lead $100M SHIELD USA project to strengthen U.S. semiconductor packaging capabilities
- CHIPS for America Announces up to $300 million in Funding to Boost U.S. Semiconductor Packaging
- Scintil Photonics names Matt Crowley as CEO, founder Sylvie Menezo will continue heading technology developments and customer partnerships
- TSMC drives A16, 3D process technology