Breaking Boundaries: Chiplet Interconnects, SDVs & electronica 2024
On this episode of Embedded Insiders, Editor-in-Chief, Ken Briodagh, sits down with Patrick Soheili and Kevin Donnelly of Eliyan to highlight the company's new Chiplet Interconnect PHY at 64Gbps in 3nm Process. The multi-die interconnect evolution marches on and Eliyan is getting a lot of attention for its ability to deliver performance and bandwidth like this in either standard or advanced packaging.
Related News
- How can in-package optical interconnects enhance chiplet generative AI performance?
- NTT looks to 15Tbit/s chiplet optical interconnects
- Alphawave Semi ‘Redefines Connectivity’ in AI Hardware and Edge AI Summit 2024 Presentation on Chiplet Interconnects
- Pre-Registration Opens for Chiplet Summit
Latest News
- Lightmatter and Amkor Technology Partner to Build World’s Largest 3D Photonics Package
- Lightmatter and ASE Partner to Bring 3D Photonics to Market
- Breaking Boundaries: Chiplet Interconnects, SDVs & electronica 2024
- The Evolution of Interconnects in Microelectronics Packaging
- Why tiny chiplets matter in the AI compute frenzy