Breaking Boundaries: Chiplet Interconnects, SDVs & electronica 2024
On this episode of Embedded Insiders, Editor-in-Chief, Ken Briodagh, sits down with Patrick Soheili and Kevin Donnelly of Eliyan to highlight the company's new Chiplet Interconnect PHY at 64Gbps in 3nm Process. The multi-die interconnect evolution marches on and Eliyan is getting a lot of attention for its ability to deliver performance and bandwidth like this in either standard or advanced packaging.
To read the full article, click here
Related News
- Alphawave Semi ‘Redefines Connectivity’ in AI Hardware and Edge AI Summit 2024 Presentation on Chiplet Interconnects
- Chiplet Interconnects Add Power And Signal Integrity Issues
- How do UCIe and BoW interconnects support generative AI on chiplets?
- How can in-package optical interconnects enhance chiplet generative AI performance?
Latest News
- IEEE Study Achieves Efficient Integration of Quantum Dot Lasers on Silicon Chiplets
- Tenstorrent Acquires Blue Cheetah, Opens Chiplet Spec
- AI Pushes High-End Mobile From SoCs To Multi-Die
- Infinitesima Metron®3D 300mm System Released for In-line Process Control by Leading DRAM Manufacturer
- Tenstorrent’s Blue Cheetah deal a harbinger of chiplet acquisition spree