Automotive Meets Chiplets: Robert Bielby’s Perspective on the Impact of Level 3 ADAS on Emerging Semiconductor Tech
August 8, 2024 -- While Level 3 ADAS (conditional automation) requires the driver to be present and engaged, the resultant heterogeneous workload, a mix of compute and AI processing, is driving the need for new system-level architectures and state-of-the-art system-on-chips (SoCs) based upon leading-edge semiconductor processes and packaging technologies. More specifically, solutions for Level 3 ADAS and above are driving the automotive industry to embrace chiplets to most efficiently and effectively address the demanding workloads by allocating the right task to the right compute engine optimized for a given task in a footprint that is most efficient from both a power and area perspective. It is also the case that chiplet-based solutions can be more cost-effective when compared to an equivalent solution based on monolithic technologies.
Chiplet technology, still in its relative infancy, enables disparate technologies and semiconductor dice to be combined in a single package through the use of die-to-die interconnect which is physically connected via a package substrate while enabling performance that is equivalent to that of a monolithic device.
In March 2022, a universal interface for the interconnection of chiplets was released. Dubbed UCIe 1.0 (Universal Chiplet Interconnect Express), the introduction of this standard, in part, reflects the broader industry awareness that the traditional benefits of scaling through process technology are being challenged. To be clear, the major semiconductor foundries continue to invest heavily in developing advanced process nodes which continue to offer improved power, performance, and area benefits. However, the economics of these advanced nodes present significant barriers to adoption for a large percentage of the ASIC / ASSP design community. Additionally, the benefits of scaling associated with migrating to the most advanced semiconductor process node do not apply uniformly across all circuit types - most notably analog circuits.
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