Advanced Packaging Depends On Materials And Co-Design

New materials play a pivotal role, but solving integration problems remains a challenge.

By Katherine Derbyshire, Semiconductor Engineering | May 22nd, 2025

Multi-die assemblies offer significant opportunities to boost performance and reduce power, but these complex packages also introduce a number of new challenges, including die-to-RDL misalignment, evolving warpage profiles, and CTE mismatch.

Heterogeneous integration — an umbrella term that covers many different applications and packaging requirements — holds the potential to combine components from several different processes into a single package. And it may be able to do so more cost-effectively and with better yield than integrating the same components on a single piece of silicon.

To read the full article, click here