What are Chiplets and how they Assemble Into the Most Advanced SoCs
If you are interested in the latest trends and innovations in the semiconductor industry, you may have heard of chiplets. But what are chiplets, and how do they enable the creation of the most advanced SoCs?
In this blog post, w will explain the concept of chiplet technology, its benefits and challenges, and some of the current and future applications of chiplets in various domains.
What Are Chiplets?
Chiplets are small, modular chips that can be combined to form a complete system-on-chip (SoC). They are designed to be used in a chiplet-based architecture, in which multiple chiplets are connected together to create a single, complex integrated circuit.
Chiplet technology is relatively new and is being actively developed by a number of companies in the semiconductor industry. The idea of chiplets originated from the project of DARPA CHIPS (Common Heterogeneous Integration and IP Reuse), which aimed to improve the overall system flexibility and performance by enabling the reuse of existing IP blocks in different configurations.
To read the full article, click here
Related Chiplet
- Direct Chiplet Interface
- HBM3e Advanced-packaging chiplet for all workloads
- UCIe AP based 8-bit 170-Gsps Chiplet Transceiver
- UCIe based 8-bit 48-Gsps Transceiver
- UCIe based 12-bit 12-Gsps Transceiver
Related Blogs
- What are chiplets?
- The Automotive Industry's Next Leap: Why Chiplets Are the Fuel for Innovation
- RISC-V Chiplets, Disaggregated Die, and Tiles
- Why Chiplets and why now?
Latest Blogs
- Cadence Recognized for Accelerating AI and 3D-IC Applications by Samsung Foundry
- Embracing the Chiplet Journey: The Shift to Chiplet-Based Architectures
- Synopsys Aims to Reduce Silicon Design Cycles by up to a Year in Collaboration with Arm
- 3 Key Takeaways from Chiplet Summit 2025
- Synopsys Bold Prediction: 50% of New HPC Chip Designs Will Be Multi-Die in 2025