What are Chiplets and how they Assemble Into the Most Advanced SoCs
If you are interested in the latest trends and innovations in the semiconductor industry, you may have heard of chiplets. But what are chiplets, and how do they enable the creation of the most advanced SoCs?
In this blog post, w will explain the concept of chiplet technology, its benefits and challenges, and some of the current and future applications of chiplets in various domains.
What Are Chiplets?
Chiplets are small, modular chips that can be combined to form a complete system-on-chip (SoC). They are designed to be used in a chiplet-based architecture, in which multiple chiplets are connected together to create a single, complex integrated circuit.
Chiplet technology is relatively new and is being actively developed by a number of companies in the semiconductor industry. The idea of chiplets originated from the project of DARPA CHIPS (Common Heterogeneous Integration and IP Reuse), which aimed to improve the overall system flexibility and performance by enabling the reuse of existing IP blocks in different configurations.
Related Chiplet
- UCIe AP based 8-bit 170-Gsps Chiplet Transceiver
- UCIe based 8-bit 48-Gsps Transceiver
- UCIe based 12-bit 12-Gsps Transceiver
- 400G Transmitter Chiplet for 400G, 800G and 1.6T Pluggable Transceivers
- FPGA Chiplets with 40K -600K LUTS
Related Blogs
- What are chiplets?
- The Automotive Industry's Next Leap: Why Chiplets Are the Fuel for Innovation
- RISC-V Chiplets, Disaggregated Die, and Tiles
- Why Chiplets and why now?
Latest Blogs
- Using Voltus IC Power Integrity to Overcome 3D-IC Design Challenges
- Advancing Die-to-Die Connectivity: The Next-Generation UCIe IP Subsystem
- Cadence Commits to Join imec Automotive Chiplet Programme
- Maximizing 3DIC Design Productivity with 3DBlox: A Look at TSMC’s Progress and Innovations in 2024
- Revolutionizing High-Performance Silicon: Alphawave Semi and Arm Unite on Next-Gen Chiplets