Unleashing AI Potential Through Advanced Chiplet Architectures
The rapid proliferation of machine-generated data is driving unprecedented demand for scalable AI infrastructure, placing extreme pressure on compute and connectivity within data centers. As the power requirements and carbon footprint of AI workloads rise, there is a critical need for efficient, high-performance hardware solutions to meet growing demands. Traditional monolithic ICs will not scale. Thus, chiplet architectures are playing a critical role in scaling AI.
Combining chiplets via low-latency and high-bandwidth connections across modular, custom components facilitates performance growth beyond the reticle limit. Connectivity standards such as UCIe enable seamless inter-die communication. Chiplets also support AI scale-up and scale-out. Even distributed AI across multiple sites benefits from chiplet architectures.
Harnessing the chiplet ecosystem to design flexible, interoperable compute and connectivity within a single package optimized for workloads is the only way to sustainably scale AI.
Data is proliferating
Machine generated data is proliferating like never before. The size of the data sphere will reach 181 billion terabytes (181 ZB) next year and the need to scale AI has accelerated new and upgraded data center infrastructure. However, processing isn’t the only limit – improvements in connectivity will also be critical in scaling AI.
A decade ago, data was primarily generated by people interacting with technology, and its growth was linear. With autonomous sensor and video data, financial data and yet more data produced by analyzing other data, the growth became exponential.
This is driving a focus on AI to parse all this data. Compute infrastructure is being pushed to the absolute limit imposed by the performance of a single full reticle-sized monolithic die. Hardware cost is a significant concern since deploying AI at scale may require, for example, 8 GPUs per server across 20,000 servers at a cost of around $4 billion. Energy is also a limiting factor representing millions of dollars in operational costs. Moreover, individual training runs are estimated to generate 500 tons of CO2 presenting environmental costs.
To read the full article, click here
Related Chiplet
- Direct Chiplet Interface
- HBM3e Advanced-packaging chiplet for all workloads
- UCIe AP based 8-bit 170-Gsps Chiplet Transceiver
- UCIe based 8-bit 48-Gsps Transceiver
- UCIe based 12-bit 12-Gsps Transceiver
Related Blogs
- Accelerating the AI Economy through Heterogeneous Integration
- Intel® Shows OCI Optical I/O Chiplet Co-packaged with CPU at OFC2024, Targeting Explosive AI Scaling
- AI System Connectivity for UCIe and Chiplet Interfaces Demand Escalating Bandwidth Needs
- Alphawave Semi Tapes Out Industry-First, Multi-Protocol I/O Connectivity Chiplet for HPC and AI Infrastructure