Siemens EDA intros next-gen ESD; focus on chiplet-design kits (CDK)
Siemens EDA has introduced the next-generation in electronic systems design (ESD) today, at the ongoing Siemens EDA PCB Forum 2024, at Radisson Blu, Bangalore.
The goals are to keep pace with accelerating innovation, and speed up product delivery.
Electronic systems innovation is accelerating, and product release cycles are measured in months, and not years. Innovation, connectivity, emerging economies, and more consumer options, are driving product replacement and upgrade cycles.
Next-generation electronic systems design is AI-assisted, cloud connected, integrated, and intuitive, besides being secure. It helps accelerate digital transformation initiatives and AI/ML implementation. Next-generation ESD allows the unified user experience that combines cloud connectivity and AI capabilities to drive innovation in electronic systems design. We are transforming electronic systems design.
To read the full article, click here
Related Chiplet
- Interconnect Chiplet
- 12nm EURYTION RFK1 - UCIe SP based Ka-Ku Band Chiplet Transceiver
- Bridglets
- Automotive AI Accelerator
- Direct Chiplet Interface
Related Blogs
- Addressing Stress In Heterogeneous 3D-IC Designs
- 3D-IC Stress Analysis
- 3D-ICs in the Automotive Market: Breaking Barriers with AI-Driven EDA Tools
Latest Blogs
- Let’s Get Serious: TeraPHY™ Optical Engine Passes the Test for AI Scale-Up at Volume
- Accelerating Early-Stage explorations with Virtual Prototyping for a thriving multi-vendor chiplet ecosystem
- Arteris’ Multi-Die Solution for the RISC-V Ecosystem
- A Beginner’s Guide to Chiplets: 8 Best Practices for Multi-Die Designs
- Case Study: How to Sign Off Your UCIe Interface