Foundry 2.0 – the New Path Forward for Moore’s Law
May 11, 2025
NHanced Semiconductor president Robert Patti’s presentation at the recent SEMIEXPO Heartland in Indianapolis, IN described the critical role of advanced packaging in continuing the progress of Moore’s Law in semiconductor development. Following is a summary of his presentation.
In Gordon Moore’s seminal paper, he predicted a ‘Day of Reckoning’ for semiconductor scaling. That day has arrived. However, as predicted, there is another path forward for semiconductors to continue progress without relying solely on ever-shrinking devices. Advanced packaging is that new path, and it is at the heart of a new industry model known as Foundry 2.0.
To read the full article, click here
Related Chiplet
- Bridglets
- Automotive AI Accelerator
- Direct Chiplet Interface
- HBM3e Advanced-packaging chiplet for all workloads
- UCIe AP based 8-bit 170-Gsps Chiplet Transceiver
Related Blogs
- Chiplet Summit 2024: Opportunities, Challenges, and the Path Forward for Chiplets
- The Chiplet Center of Excellence sets new standards for the automotive industry
- Securing the New Frontier: Chiplets & Hardware Security Challenges
- The Need for Chiplets, and UCIe in Automotive
Latest Blogs
- Foundry 2.0 – the New Path Forward for Moore’s Law
- Cadence and AVCC to Advance Physical AI Innovations for Autonomous Vehicles
- Intel and Alphawave Semi Demonstrates UCIe Interoperability
- TSMC Brings Packaging Center Stage with Silicon
- Four Reasons Chiplets Will Take Over the World (and why it hasn’t happened yet)