Eliyan - Chiplet Ecosystem

Eliyan Corporation is leading the chiplet revolution, focusing on a fundamental challenge with scaling semiconductor performance, size, power, and cost to meet the needs of high-performance computing applications, from desktop to datacenter. It has developed a breakthrough method to enable the industry’s highest performing interconnect for homogenous and heterogenous multi-die architectures using both advanced and standard packaging substrate. To date, the company has received funding from Celesta Capital, Cleveland Avenue, Intel Capital, Mesh Ventures, Micron Ventures, Samsung Catalyst Fund, SK hynix, Tiger Global Management, and Tracker Capital Management. It is based in Santa Clara, California.

The Ultimate Chiplet Interconnect.

Eliyan’s NuLink™ PHY technology can be optimized for high-speed serial die-to-die connections using any industry standard or custom interconnect scheme. It can deliver outstanding performance at low power in advanced packaging or standard packaging using a wide range of bump pitches.