Chipletz, Inc. - Chiplet Ecosystem

Chipletz, incorporated in 2021, offers Smart Substrate™ products, an advanced packaging technology that addresses the increasing demand for compute performance as Moore's Law slows down. Targeting AI workloads, immersive applications, and high-performance computing systems, Chipletz aims to deliver its initial products to customers and partners in 2024.

Scaling Performance beyond Moore's Law

In a world where the gains from transistor scaling are increasingly marginal, our pioneering approach using advanced packaging meaningfully scales system performance to address the most demanding computing applications of the future.