3M - Chiplet Ecosystem
Technology trends in 5G, augmented and virtual reality, IoT, and autonomous driving are fueling an unprecedented demand for smaller devices with increased functionality, memory and speed. Semiconductors are a key variable in meeting new requirements and it’s up to manufacturers to find solutions. That’s where 3M can help. From fabrication and advanced packaging, to component packaging and manufacturing equipment support and maintenance, our goal is to improve product performance, process efficiency and yield, so you can move confidently into the future.
3M has applied decades of science-based expertise to a range of materials for semiconductor manufacturing processes and equipment solutions. Our innovations are used in etching and deposition, CMP and surface-finishing materials for wafer processing, advanced packaging materials, tape and reel for chip transport, and materials for wafer doping and ion implantation. For equipment support, we’ve developed proprietary fluid technology for cleaning and thermal management.
We want our innovations to help you shape the future of the semiconductor industry. 3M material experts are here to apply extensive research and development to your needs and deliver a solution through our global manufacturing reach. With access to more than 50 technology platforms, no challenge is too complex — we’re ready to help.
What's New
Corporate Headquarters
3M
USA
USA